Memory IC GD25WQ32ESIGR product image

GD25WQ32ESIGR

$0.95
  • Description:IC FLASH 32MBIT SPI/QUAD 8SOP
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:aaa2104f5aec Category: Brand:

  
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GD25WQ32ESIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 32MBIT SPI/QUAD 8SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25WQ32ESIGR

  • Description:IC FLASH 32MBIT SPI/QUAD 8SOP
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:32Mbit
  • Memory Organization:4M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:104 MHz
  • Write Cycle Time - Word, Page:120µs, 4ms
  • Voltage - Supply:1.65V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.209", 5.30mm Width)
  • Supplier Device Package:8-SOP
  • Access Time:8 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25WQ32ESIGR

GD25WQ32ESIGR

Memory IC Overview

The GD25WQ32ESIGR is a 32 Mbit NOR flash memory IC manufactured by GigaDevice. It utilizes an SPI interface with Quad I/O support and operates at a maximum clock frequency of 104 MHz. The device features a 4 M x 8 organization with an 8-bit data bus width. It functions within a supply voltage range of 1.65 V to 3.6 V, drawing a maximum active read current of 25 mA. The component is housed in an 8-SOP package and supports surface mount installation. It maintains reliable operation across a temperature range of -40°C to +85°C.

Memory IC Feature Summary

  • Supports standard SPI and Quad I/O protocols for flexible data transfer modes.
  • Operates on low-voltage power supplies ranging from 1.65 V to 3.6 V.
  • Provides non-volatile storage using SLC NAND technology architecture.

Memory IC Applications

  • Embedded systems requiring code execution directly from memory
  • Consumer electronics firmware storage
  • Industrial control system configuration retention

Memory IC Procurement Notes

Verify the specific suffix 'IGR' against the manufacturer's official datasheet to confirm package dimensions and tape-and-reel specifications. Ensure compatibility with the target board's SOP-8 footprint and soldering profile. Confirm that the operating voltage requirements align with the system's power rails before integration.

Memory IC Selection Notes

Select this component when a 32 Mbit capacity is required with low-voltage operation down to 1.65 V. The 104 MHz speed suits applications needing moderate access times without high-power consumption. The SOP-8 package offers a compact solution for space-constrained designs compared to larger packages.

Memory IC Part Context

This part belongs to the GD25WQ32E series of SPI NOR flash memories. It shares architectural similarities with other devices in the family but differs in storage density and package options. The series is designed for general-purpose embedded applications requiring reliable non-volatile data retention.

Memory IC Replacement Considerations

Check for direct substitutes within the GD25WQ32E series or equivalent 32 Mbit SPI NOR flashes from other manufacturers. Verify pinout compatibility and electrical parameter alignment before substitution.

GD25WQ32ESIGRGD25WQ32ESIGR
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