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GD25X512MEF2RR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 512MBIT SPI/OCTAL 16SOP. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25X512MEF2RR
- Description：IC FLASH 512MBIT SPI/OCTAL 16SOP
- Series：GD25X
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：512Mbit
- Memory Organization：64M x 8
- Memory Interface：SPI - Octal I/O
- Clock Frequency：200 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 105°C (TA)
- Mounting Type：Surface Mount
- Package / Case：16-SOIC (0.295", 7.50mm Width)
- Supplier Device Package：16-SOP
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25X512MEF2RR
Memory IC Overview
The GD25X512MEF2RR is a 512 Mbit NOR flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 2.7 V to 3.6 V and supports standard SPI interface protocols. The component achieves a maximum clock frequency of 166 MHz, ensuring efficient data transfer rates for embedded applications. Designed for surface-mount installation, it utilizes an SOP-16 package configuration. The device is rated for industrial temperature ranges, functioning reliably between -40°C and +85°C.
Memory IC Feature Summary
- Supports standard Serial Peripheral Interface (SPI) communication protocols for system integration.
- Provides non-volatile storage with 512 Mbit density for code execution and data retention.
- Operates on a single 2.7 V to 3.6 V power supply rail.
Memory IC Applications
- Embedded systems requiring reliable code storage
- Industrial control equipment firmware hosting
- Consumer electronics application programming
Memory IC Procurement Notes
Verify the specific suffix F2RR against official datasheets to confirm package dimensions and tape-and-reel specifications. Ensure the design accommodates the SOP-16 footprint and thermal requirements for the specified operating temperature range. Confirm availability status through authorized distributors as supply conditions may vary.
Memory IC Selection Notes
Select this component when a standard SPI interface is required rather than high-speed OPI or DTR modes. It is suitable for designs operating at 3.3 V logic levels. Consider alternative models like GD25T512 if extended temperature ranges up to 105°C are necessary for the target environment.
Memory IC Part Context
This part belongs to the GD25 series of SPI NOR flash memories from GigaDevice. These devices are engineered for general-purpose storage needs in consumer and industrial sectors. The series offers various densities and package options to support diverse embedded design constraints and performance requirements.
Memory IC Replacement Considerations
GD25T512MEF2RR provides similar specifications with an extended industrial temperature range up to 105°C. Verify pin compatibility and electrical characteristics before substitution.
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