Memory IC GD55B01GEB2RY product image

GD55B01GEB2RY

$11.22
  • Description:IC FLASH 1GBIT SPI/QUAD 24TFBGA
  • Series:GD55B
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray

SKU:814cc3238bce Category: Brand:

  
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GD55B01GEB2RY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 1GBIT SPI/QUAD 24TFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD55B01GEB2RY

  • Description:IC FLASH 1GBIT SPI/QUAD 24TFBGA
  • Series:GD55B
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:1Gbit
  • Memory Organization:128M x 8
  • Memory Interface:SPI - Quad I/O, QPI, DTR
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:24-TBGA
  • Supplier Device Package:24-TFBGA (6x8)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD55B01GEB2RY

GD55B01GEB2RY

Memory IC Overview

The GD55B01GEB2RY is a 1 Gbit SPI NOR Flash memory device manufactured by GigaDevice. It utilizes a 24-TFBGA (6x8) surface-mount package and operates within a supply voltage range of 2.7 V to 3.6 V. The component supports an interface clock frequency of up to 133 MHz and functions reliably across an industrial temperature range from -40°C to +105°C.

Memory IC Feature Summary

  • Supports Quad I/O, QPI, and DTR interface modes for high-speed data transfer
  • Provides non-volatile storage with SLC NAND technology architecture

Memory IC Applications

  • Industrial control systems requiring wide temperature operation
  • Automotive embedded applications
  • Consumer electronics firmware storage

Memory IC Procurement Notes

Verify the specific suffix B2RY against official datasheets to confirm pinout and electrical characteristics. Confirm availability status as supply constraints may affect order fulfillment. Ensure compatibility with existing PCB footprint designs utilizing the 24-TFBGA package before procurement.

Memory IC Selection Notes

Select this component when a 1 Gbit density is required in a compact TFBGA form factor. It is suitable for designs needing industrial-grade temperature stability and standard 3V logic levels. Consider alternative packages if space constraints differ or if lower voltage operation is necessary.

Memory IC Part Context

This part belongs to the GD55B series of SPI NOR Flash memories. The series targets diverse market segments including automotive and industrial applications, offering scalability in density and package options while maintaining reliability standards for embedded code storage solutions.

Memory IC Replacement Considerations

Check for direct substitutes within the GD55B family with identical pinouts. Verify that any replacement maintains the same 24-TFBGA package and 133 MHz speed grade to ensure functional equivalence without redesign.

GD55B01GEB2RYGD55B01GEB2RY
$11.22
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