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GD55B01GEYIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 1GBIT SPI/QUAD. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD55B01GEYIGR
- Description：IC FLASH 1GBIT SPI/QUAD
- Series：GD55B
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：1Gbit
- Memory Organization：128M x 8
- Memory Interface：SPI - Quad I/O, QPI, DTR
- Clock Frequency：133 MHz
- Write Cycle Time - Word, Page：50µs, 1ms
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-WDFN Exposed Pad
- Supplier Device Package：8-WSON (6x8)
- Access Time：6 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD55B01GEYIGR
Memory IC Overview
The GD55B01GEYIGR is a 1 Gbit Serial NOR Flash memory device manufactured by GigaDevice. It utilizes an 8-WSON (6x8 mm) surface-mount package and operates within a supply voltage range of 2.7 V to 3.6 V. The component supports SPI, Quad I/O, QPI, and DTR interfaces with a maximum clock frequency of 133 MHz. It features a 128M x 8 memory organization and functions reliably across an industrial temperature range of -40°C to +85°C.
Memory IC Feature Summary
- Supports multiple interface modes including Single I/O, Quad I/O, QPI, and DTR for flexible system integration.
- Integrates hardware-based ECC algorithms and CRC checksums to enhance data integrity and reliability.
- Includes security registers with OTP locks and unique ID capabilities for robust device protection.
Memory IC Applications
- Code storage in automotive electronic control units
- Data logging in industrial embedded systems
- Firmware storage in consumer electronics devices
Memory IC Procurement Notes
Verify the specific suffix 'GR' indicates reel packaging when sourcing components. Confirm that the 8-WSON package dimensions match the target PCB footprint requirements. Ensure the operating voltage aligns with the 2.7V to 3.6V specification during system design validation.
Memory IC Selection Notes
Select this part for applications requiring high-density code storage in compact form factors. The 133 MHz speed supports efficient instruction execution. Consider the 8-WSON package size constraints and verify thermal management needs for the specified industrial temperature range.
Memory IC Part Context
This component belongs to the GD55B series of SPI NOR Flash memories. It shares architectural similarities with other devices in the family but differs in density and package options. The series is designed for high-reliability applications requiring fast read speeds and robust data retention characteristics.
Memory IC Replacement Considerations
GD55B01GEYIGY offers identical electrical specifications but uses tray packaging instead of reel format. GD55B01GEFIRR provides the same performance metrics in a 16-SOP package for different board layout requirements.
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