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GD55LB01GEB2RY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 1GBIT SPI/QUAD 24TFBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD55LB01GEB2RY
- Description：IC FLASH 1GBIT SPI/QUAD 24TFBGA
- Series：GD55LB
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：1Gbit
- Memory Organization：128M x 8
- Memory Interface：SPI - Quad I/O, QPI, DTR
- Clock Frequency：166 MHz
- Write Cycle Time - Word, Page：140µs, 2ms
- Voltage - Supply：1.65V ~ 2V
- Operating Temperature：-40°C ~ 105°C (TA)
- Mounting Type：Surface Mount
- Package / Case：24-TBGA
- Supplier Device Package：24-TFBGA (6x8)
- Access Time：6 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD55LB01GEB2RY
Memory IC Overview
The GD55LB01GEB2RY is a 1 Gbit NOR flash memory device manufactured by GigaDevice. It utilizes a TFBGA-24 package for surface mount installation. The component operates within a supply voltage range of 1.65 V to 2 V and supports SPI interface communication with a maximum clock frequency of 166 MHz. It is designed for industrial temperature environments, functioning reliably between -40°C and +85°C.
Memory IC Feature Summary
- Supports high-speed SPI interface operations up to 166 MHz
- Operates on low voltage supply ranging from 1.65 V to 2 V
- Engineered for industrial temperature stability from -40°C to +85°C
Memory IC Applications
- Industrial data storage systems
- Embedded code execution applications
- IoT device firmware storage
Memory IC Procurement Notes
Verify the specific suffix 'B2RY' against official manufacturer documentation to confirm package dimensions and tape-and-reel specifications. Ensure the 1.65V–2V operating voltage aligns with target system power rails. Confirm availability through authorized distributors as stock levels fluctuate. Request updated datasheets for any recent revisions to ensure compatibility with existing designs.
Memory IC Selection Notes
Select this component when a 1 Gbit density is required in a compact TFBGA-24 form factor. It is suitable for designs constrained by low voltage power supplies around 1.8V. Consider alternative models if higher temperature ratings or different voltage ranges are necessary. Verify pinout compatibility with existing PCB layouts before integration.
Memory IC Part Context
This part belongs to the GD55L series of SPI NOR flash memories from GigaDevice. The series offers various densities and voltage options tailored for mobile and industrial applications. The GD55LB01 variant specifically targets low-voltage requirements while maintaining high performance standards for reliable data retention and access speeds.
Memory IC FAQ
What is the maximum operating temperature for the GD55LB01GEB2RY?
The maximum operating temperature is +85°C.
Does this component support Quad I/O mode?
Yes, the GD55LB01GEB2RY supports Single, Dual, and Quad I/O modes via its SPI interface.
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