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GD55LB02GEBIRY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 2GBIT SPI/QUAD 24TFBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD55LB02GEBIRY
- Description：IC FLASH 2GBIT SPI/QUAD 24TFBGA
- Series：GD55LB
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：2Gbit
- Memory Organization：256M x 8
- Memory Interface：SPI - Quad I/O, QPI, DTR
- Clock Frequency：133 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：1.65V ~ 2V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：24-TBGA
- Supplier Device Package：24-TFBGA (6x8)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD55LB02GEBIRY
Memory IC Overview
The GD55LB02GEBIRY is a 2 Gbit SPI NOR Flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 1.65 V to 2 V and supports a maximum clock frequency of 166 MHz. The component utilizes an 8-bit data bus width and features a TFBGA-24 package for surface mount installation. It is designed for industrial applications with a specified operating temperature range from -40°C to +85°C.
Memory IC Feature Summary
- Supports high-speed serial peripheral interface communication with clock frequencies up to 166 MHz
- Operates on low voltage power supplies ranging from 1.65 V to 2 V
- Provides non-volatile code storage in a compact surface-mount package
Memory IC Applications
- Embedded systems requiring low-power code storage
- Industrial control units
- Consumer electronics devices
Memory IC Procurement Notes
Verify the specific suffix designations against official manufacturer documentation to confirm exact electrical characteristics and packaging variants. Ensure compatibility with system voltage requirements, as this model specifies a narrow 1.65 V to 2 V operating range distinct from standard 3V parts. Confirm package dimensions match PCB footprint designs prior to integration.
Memory IC Selection Notes
Select this component when a 2 Gbit density is required alongside strict low-voltage operation constraints. The 166 MHz speed capability suits applications needing efficient instruction fetch rates. Verify that the target environment remains within the -40°C to +85°C industrial temperature limits to ensure reliable performance over the product lifecycle.
Memory IC Part Context
This part belongs to the GD55 series of SPI NOR Flash memories from GigaDevice. The series targets diverse market segments with densities up to 2Gb. These components are engineered for high performance and reliability, supporting various interface modes including standard SPI and Quad I/O operations for flexible system integration.
Memory IC Replacement Considerations
GD55LB01GEBIRY: Offers identical electrical specifications and package but with 1 Gbit density.
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