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GD55LE511MEWIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC MEMORY. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD55LE511MEWIGR
- Description：IC MEMORY
- Series：-
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：-
- Memory Format：-
- Technology：-
- Memory Size：-
- Memory Organization：-
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD55LE511MEWIGR
Memory IC Overview
The GD55LE511MEWIGR is a NOR Flash memory device manufactured by GigaDevice. It utilizes an SPI interface for data communication and is housed in a WSON-8 package. The component operates within a temperature range of -40°C to +85°C, ensuring reliability in industrial environments. As part of the GD55 series, it supports automotive-grade standards including AEC-Q100 Grade 1 compliance and ISO 26262:2018 ASIL D functional safety requirements.
Memory IC Feature Summary
- Complies with AEC-Q100 Grade 1 and ISO 26262:2018 ASIL D functional safety standards
- Supports Standard, Dual, Quad, and Octal SPI interfaces for high-speed data transfer
- Integrates hardware ECC algorithms and CRC checksums for enhanced data integrity
- Designed for long-term reliability with extended data retention capabilities
Memory IC Applications
- Advanced Driver Assistance Systems (ADAS)
- Autonomous Driving systems
- Intelligent Cockpit applications
- Zonal and Centralized Computing architectures
Memory IC Procurement Notes
Verify the specific suffix 'MEWIGR' against the official manufacturer datasheet to confirm pinout, voltage, and package dimensions. Ensure the selected variant meets the required automotive qualification standards and operating temperature range for your specific application environment before finalizing procurement.
Memory IC Selection Notes
Select this component when designing automotive electronics requiring robust code storage with functional safety certifications. Consider its support for multiple SPI modes and integrated error correction features if system reliability and data integrity are critical constraints for the embedded design.
Memory IC Part Context
This device belongs to the GD25/55 Automotive SPI NOR Flash family from GigaDevice. This portfolio is engineered for next-generation vehicle architectures, offering densities up to 2Gb. The series is trusted by Tier 1 suppliers and OEMs for mission-critical automotive electronics due to its high performance and durability.
Memory IC Replacement Considerations
Consult the official GigaDevice product selector or datasheet for confirmed substitute part numbers within the GD55 series that match the required density, package, and interface specifications.
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