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GD55LE511MEWIGY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC MEMORY. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD55LE511MEWIGY
- Description：IC MEMORY
- Series：-
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tray
- Memory Type：-
- Memory Format：-
- Technology：-
- Memory Size：-
- Memory Organization：-
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD55LE511MEWIGY
Memory IC Overview
The GD55LE511MEWIGY is a NOR Flash memory component manufactured by GigaDevice. It features a storage capacity of 512 Mbit and utilizes an SPI interface for data communication. The device is housed in a WSON-8 package, suitable for surface-mount applications. It operates within a voltage range of 2.7 V to 3.6 V and supports a maximum clock frequency of 133 MHz. The operational temperature range extends from -40°C to +85°C, ensuring reliability in industrial environments.
Memory IC Feature Summary
- Supports standard SPI and Quad SPI modes for flexible data transfer
- Provides high-density code storage with fast read access capabilities
- Includes hardware write protection and security features for data integrity
Memory IC Applications
- Industrial control systems requiring reliable code execution
- Consumer electronics devices needing compact storage solutions
- IoT modules utilizing low-power embedded memory
Memory IC Procurement Notes
Verify the exact suffix 'WIGY' against official GigaDevice documentation to confirm pinout and package dimensions. Ensure compatibility with existing PCB footprints before ordering. Confirm availability through authorized distributors as supply levels may vary. Request updated datasheets to validate electrical characteristics for your specific design requirements.
Memory IC Selection Notes
Select this part when a 512 Mbit density is required in a small WSON-8 footprint. It is suitable for designs operating at 3V logic levels. Consider alternative densities if larger storage is needed. Verify that the 133 MHz speed meets system timing constraints. Check thermal specifications for enclosed enclosures.
Memory IC Part Context
This component belongs to the GD55 series of SPI NOR Flash memories from GigaDevice. The series offers various densities and packages tailored for different application needs. It complements other flash products like the GD55B and GD55T series, providing options for different voltage and performance profiles.
Memory IC Replacement Considerations
Check for direct substitutes within the GD55LE family with identical pinouts. Verify cross-references with other manufacturers offering 512 Mbit WSON-8 SPI NOR flashes. Ensure functional equivalence in command sets and timing parameters before substitution.
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