ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
GD55LE511MEYIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC MEMORY. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD55LE511MEYIGR
- Description：IC MEMORY
- Series：-
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：-
- Memory Format：-
- Technology：-
- Memory Size：-
- Memory Organization：-
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD55LE511MEYIGR
Memory IC Overview
The GD55LE511MEYIGR is a NOR flash memory component manufactured by GigaDevice. It utilizes an SPI interface for data communication and is housed in a WSON-8 package. The device operates within a temperature range of -40°C to +85°C. It belongs to the GD25/55 series, which supports various voltage levels including 3V, 1.8V, and 1.65V~3.6V ranges. This product is classified as a new item from the manufacturer.
Memory IC Feature Summary
- Supports Standard, Dual, Quad, and Octal SPI interfaces for flexible connectivity
- Integrated hardware ECC algorithms and CRC checksums for enhanced data reliability
- Designed for high performance with low power consumption characteristics
- Capable of sustaining 100,000 program/erase cycles with long-term data retention
Memory IC Applications
- Automotive infotainment systems (IVI)
- Advanced driver assistance systems (ADAS)
- Intelligent cockpit applications
- Battery management systems (BMS)
Memory IC Procurement Notes
Verify the specific voltage grade and automotive qualification status against the official datasheet before procurement. Confirm that the WSON-8 package dimensions match your PCB footprint requirements. Ensure the operating temperature range aligns with your system's environmental conditions. Cross-reference the ordering suffix to confirm the exact density and feature set intended for your design.
Memory IC Selection Notes
Select this component when designing systems requiring reliable code storage in automotive or industrial environments. Consider its compatibility with 1.8V and 3V power supplies for broader integration options. Evaluate its ECC capabilities if data integrity is critical for your application. Ensure your controller supports the required SPI modes for optimal performance.
Memory IC Part Context
This part belongs to the GigaDevice GD25/55 SPI NOR Flash family, which targets diverse market segments with densities ranging from 512Kb to 2Gb. The series is designed for high performance and reliability, often used in embedded applications requiring robust code storage solutions across consumer and automotive electronics.
Memory IC Replacement Considerations
Check for compatible parts within the GD25/55 series that offer similar density and package types. Verify electrical specifications such as voltage range and interface speed to ensure functional equivalence. Consult official substitution lists for any updated revisions or alternative packages offered by the manufacturer.
Explore related parts through Memory, Integrated Circuits (ICs), all product categories, ChipApex homepage.
