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GD55LE511MEYIGY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC MEMORY. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD55LE511MEYIGY
- Description：IC MEMORY
- Series：-
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tray
- Memory Type：-
- Memory Format：-
- Technology：-
- Memory Size：-
- Memory Organization：-
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD55LE511MEYIGY
Memory IC Overview
The GD55LE511MEYIGY is a SPI NOR Flash memory device manufactured by GigaDevice. It operates within an industrial temperature range of -40°C to +85°C and utilizes a WSON-8 package. The component supports standard SPI, Dual SPI, Quad SPI, and QPI interfaces for data communication.
Memory IC Feature Summary
- Supports multiple interface modes including Standard, Dual, Quad SPI, and QPI for flexible system integration.
- Designed for industrial applications with extended temperature operation capabilities.
- Provides reliable code storage solutions suitable for embedded systems.
Memory IC Applications
- Industrial control systems
- Embedded computing devices
- Consumer electronics firmware storage
Memory IC Procurement Notes
Verify the specific suffix 'GY' against official datasheets to confirm exact voltage or package variations. Ensure compatibility with existing PCB footprints for WSON-8 packages. Confirm supply chain authenticity through authorized distributors to prevent counterfeit components in industrial deployments.
Memory IC Selection Notes
Select this component when industrial temperature stability is required alongside compact packaging. Compare interface speeds and power consumption against other SPI NOR options. Validate that the WSON-8 form factor meets space constraints in the target design.
Memory IC Part Context
This part belongs to the GD55 series of SPI NOR Flash memories from GigaDevice. The series targets diverse market segments with varying densities and voltage requirements. It complements the broader portfolio of flash memory products designed for reliability and scalability in embedded applications.
Memory IC Replacement Considerations
Check for direct pin-compatible alternatives within the GD25/55 family. Verify electrical specifications match before substitution. Consult official cross-reference lists for validated replacements.
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