GD55LT02GEB2RY

Memory IC Overview

The GD55LT02GEB2RY is a 2 Gbit SPI NOR Flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 1.65 V to 2 V and supports a maximum clock frequency of 166 MHz. The component utilizes an SPI interface and is housed in a TFBGA-24 package designed for surface mount installation. It functions reliably across an industrial temperature range from -40°C to +85°C.

Memory IC Feature Summary

• Supports high-speed serial peripheral interface communication with frequencies up to 166 MHz
• Operates on low voltage power supplies ranging from 1.65 V to 2 V
• Provides 2 Gbit storage capacity in a compact TFBGA-24 surface mount package

Memory IC Applications

• Consumer electronics requiring code storage
• Embedded systems needing non-volatile memory
• Industrial control applications

Memory IC Procurement Notes

Verify the exact suffix against official manufacturer documentation, as variations exist between similar part numbers like GD55LT02GEBIRY and GD55X01GEB2RY. Confirm that the specific ordering code matches the required voltage and package specifications before procurement. Ensure compatibility with system design requirements regarding operating temperature and interface protocols.

Memory IC Selection Notes

Select this component when a 2 Gbit density is required alongside a 1.65 V to 2 V operating voltage profile. The TFBGA-24 package suits designs prioritizing space efficiency. Verify that the 166 MHz SPI interface meets the bandwidth needs of the target application. Consider the -40°C to +85°C temperature range for environmental suitability.

Memory IC Part Context

This device belongs to the GigaDevice GD55 series of SPI NOR Flash memories. The series offers densities from 512Kb to 2Gb and supports various voltage options including 3V, 1.8V, and 1.65V~3.6V ranges. The GD55 series targets diverse market segments with features such as high performance and low power consumption.

Memory IC Replacement Considerations

GD55LT02GEBIRY shares identical electrical parameters and package type but may differ in packaging or qualification details. Cross-reference official datasheets to confirm functional equivalence before substitution.