Memory IC GD55LX02GEB2RY product image

GD55LX02GEB2RY

$25.63
  • Description:IC FLASH 2GBIT SPI/QUAD
  • Series:GD55LX
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray

SKU:24dec5381321 Category: Brand:

  
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GD55LX02GEB2RY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 2GBIT SPI/QUAD. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD55LX02GEB2RY

  • Description:IC FLASH 2GBIT SPI/QUAD
  • Series:GD55LX
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:2Gbit
  • Memory Organization:256M x 8
  • Memory Interface:SPI - Octal I/O, DTR
  • Clock Frequency:166 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:24-TBGA
  • Supplier Device Package:24-TFBGA (6x8)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD55LX02GEB2RY

GD55LX02GEB2RY

Memory IC Overview

The GD55LX02GEB2RY is a 2 Gbit SPI NOR Flash memory component manufactured by GigaDevice. It utilizes SLC NAND technology and supports Octal I/O with Double Data Rate (DTR) interface modes, operating at clock frequencies up to 166 MHz. The device features a 256M x 8 memory organization and is housed in a 24-TFBGA package measuring 6x8 mm. It operates within a supply voltage range of 1.65V to 2V and supports an industrial temperature range of -40°C to 85°C.

Memory IC Feature Summary

  • Supports high-speed data transfer via Octal SPI interface with DTR mode
  • Integrates hardware-based ECC algorithms for enhanced data integrity
  • Designed for low power consumption suitable for mobile applications

Memory IC Applications

  • Smartphone camera modules
  • Touch controllers
  • Fingerprint sensors
  • AMOLED displays

Memory IC Procurement Notes

Verify the specific suffix 'B' against official datasheets to confirm pinout and electrical characteristics, as variations may exist within the GD55LX family. Confirm availability through authorized distributors, as standard packaging quantities are typically 4800 units per tray. Ensure the 1.65V-2V voltage domain aligns with system design requirements before procurement.

Memory IC Selection Notes

Select this component when high-density code storage is required in space-constrained mobile devices. The Octal DTR interface offers superior bandwidth compared to Quad SPI variants. Verify that the target application environment remains within the specified -40°C to 85°C operating temperature range and that the system power rail supports the 1.65V to 2V input requirement.

Memory IC Part Context

This part belongs to the GD55LX series of SPI NOR Flash memories from GigaDevice. The series targets mobile solutions requiring high performance and reliability. It complements other flash products like the GD55T and GD55X series, offering different density and interface options for various embedded storage needs in consumer electronics.

Memory IC Replacement Considerations

Check for GD55LX02GEBIRY as a potential variant within the same density class. Verify package compatibility and voltage specifications before substitution. Consult official replacement lists for automotive-grade alternatives if higher reliability standards are required.

GD55LX02GEB2RYGD55LX02GEB2RY
$25.63
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