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GD55LX02GEBIRY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 2GBIT SPI/QUAD. Review the specifications below when checking this part for your BOM.
The GD55LX02GEBIRY is a 2 Gbit NOR flash memory device manufactured by GigaDevice. It utilizes a TFBGA-24 package for surface mount installation. The component operates within a supply voltage range of 1.65 V to 2 V and supports an SPI interface with Octal I/O, DTR capability at a maximum clock frequency of 166 MHz. It features an 8-bit data bus width and functions reliably across an operating temperature range of -40°C to +85°C.
Verify the specific ordering suffix against the manufacturer's official datasheet to ensure correct package type and temperature rating. Confirm that the required voltage domain aligns with the 1.65 V to 2 V specification. Check for any recent lifecycle status updates or alternative package options directly from GigaDevice authorized channels before finalizing procurement plans.
Select this component when system design requires 2 Gbit capacity within a small TFBGA-24 footprint. Ensure the host controller supports Octal SPI and DTR protocols to utilize the 166 MHz clock speed. Verify that the application environment remains within the specified -40°C to +85°C temperature range and that the power supply strictly adheres to the 1.65 V to 2 V limits.
This part belongs to the GD55LX series of NOR flash memories designed for mobile applications. It complements GigaDevice's portfolio for smartphones and IoT sensors. The series focuses on optimizing power consumption and battery life while providing reliable data storage for firmware and media in space-constrained electronic devices.
Consult the official GigaDevice product selection guide for verified pin-compatible or functionally equivalent alternatives within the GD55LX family. Cross-reference specifications such as voltage range, interface type, and package dimensions to ensure compatibility with existing board layouts and system requirements.
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