GD55T01GEF2RR

Memory IC Overview

The GD55T01GEF2RR is a 1 Gbit SPI NOR Flash memory manufactured by GigaDevice. It operates within a supply voltage range of 2.7 V to 3.6 V and supports a maximum clock frequency of 200 MHz. The device features synchronous timing and offers multiple interface modes, including DTR/Quad SPI, QPI, and standard SPI. Designed for surface-mount installation, it functions reliably in temperatures from -40°C upwards.

Memory IC Feature Summary

• Supports high-speed data transfer via DTR/Quad SPI, QPI, and standard SPI interfaces
• Operates with a maximum clock frequency of 200 MHz for efficient code execution
• Provides 1 Gbit storage capacity suitable for complex embedded applications

Memory IC Applications

• Wireless routers and base stations
• Optical modules
• Network communication equipment

Memory IC Procurement Notes

Verify the specific suffix 'EF2RR' against official GigaDevice documentation to confirm package type and tape-and-reel specifications. Ensure compatibility with system voltage requirements (2.7V–3.6V) and interface configurations before integration. Cross-reference part numbers with authorized distributors to avoid counterfeit components.

Memory IC Selection Notes

Select this component when high-density code storage and fast read speeds are required for network infrastructure. The 200 MHz clock rate supports demanding throughput needs. Confirm that the system design accommodates the specified voltage range and industrial temperature operating conditions for reliable long-term performance.

Memory IC Part Context

This part belongs to the GD55 series of SPI NOR Flash memories from GigaDevice. The series targets high-performance applications requiring scalability and reliability. It complements other flash solutions by offering specific interface options and density levels tailored for modern electronic systems.

Memory IC Replacement Considerations

Check for alternative GD55 series variants with matching 1 Gbit density and compatible interface support. Verify pinout and package dimensions if substituting with different suffixes. Ensure thermal and electrical characteristics align with existing design constraints.