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GD55T01GEFERR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD55T01GEFERR
- Description：IC FLASH
- Series：-
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：-
- Memory Format：FLASH
- Technology：FLASH - NOR
- Memory Size：-
- Memory Organization：-
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD55T01GEFERR
Memory IC Overview
The GD55T01GEFERR is a 1 Gbit NOR Flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 2.7 V to 3.6 V and supports DTR/Quad SPI, QPI, and SPI interface types. The component features a maximum clock frequency of 200 MHz with synchronous timing. Designed for surface mount installation, it functions at temperatures as low as -40°C and is supplied in a reel package format.
Memory IC Feature Summary
- Supports high-speed DTR/Quad SPI, QPI, and standard SPI interfaces for flexible system integration
- Delivers high performance with a maximum clock frequency of 200 MHz
- Provides reliable operation across extended industrial temperature ranges
Memory IC Applications
- Mobile devices including smartphones and tablets
- Camera modules and touch controllers
- Consumer electronics requiring code storage
Memory IC Procurement Notes
Verify the specific suffix 'R' corresponds to the Reel packaging configuration as indicated in distributor specifications. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure the selected variant matches the required interface modes and voltage levels for the target application design.
Memory IC Selection Notes
Select this component when a 1 Gbit density is required with support for advanced high-speed interfaces like DTR and QPI. Consider the 200 MHz clock capability for applications demanding rapid data access. Verify that the SMD/SMT form factor and operating temperature range align with the board layout and environmental constraints of the final product.
Memory IC Part Context
This part belongs to the GD55 series of SPI NOR Flash memories from GigaDevice. The series targets diverse market segments with densities up to 2Gb. These products are designed for high performance and reliability, often utilized in mobile solutions and consumer electronics where efficient power consumption and compact packages are critical requirements.
Memory IC Replacement Considerations
The GD55T01GEBARY shares identical electrical specifications but utilizes Tray packaging instead of Reel. Verify if the change in physical packaging affects the assembly process or automated handling equipment in the manufacturing line.
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