GD55T01GEY2GR

Memory IC Overview

The GD55T01GEY2GR is a 1 Gbit SPI NOR Flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 2.7 V to 3.6 V and supports a maximum clock frequency of 166 MHz. The component utilizes a Serial Peripheral Interface (SPI) for data communication. Designed for surface-mount installation, it is housed in an 8-lead WSON package. The device ensures reliable operation across an extended industrial temperature range from -40°C to +105°C.

Memory IC Feature Summary

• Supports high-speed serial data transfer via standard SPI interface with frequencies up to 166 MHz
• Provides robust code storage capabilities with 1 Gbit density for embedded applications
• Engineered for stable performance under varying thermal conditions suitable for industrial environments

Memory IC Applications

• Embedded systems requiring non-volatile code execution
• Industrial control equipment needing reliable data retention
• Consumer electronics utilizing surface-mount technology constraints

Memory IC Procurement Notes

Verify the specific suffix Y2GR against the manufacturer's official datasheet to confirm package dimensions and tape-and-reel specifications. Ensure that the 2.7V minimum operating voltage aligns with your system's power rail design. Confirm that the WSON-8 footprint matches your PCB layout requirements before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 1 Gbit capacity is required for code storage in space-constrained designs. The WSON-8 package offers a compact solution for surface-mount assembly. Consider the 166 MHz speed capability if high-throughput data access is necessary. Verify that the operating temperature range meets the environmental demands of the target application.

Memory IC Part Context

This part belongs to the GD55 series of SPI NOR Flash memories from GigaDevice. The series targets diverse market segments with densities ranging up to 2Gb. These devices are designed to deliver high performance and reliability for consumer and industrial applications, supporting various voltage levels and package options to meet different design requirements.

Memory IC Replacement Considerations

Consult the official GigaDevice product selector guide for compatible alternatives. Verify pin compatibility and electrical characteristics such as voltage range and interface type before substituting. Cross-reference package dimensions to ensure mechanical fit within the existing design constraints.