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GD55WB512MEYIGY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 512MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD55WB512MEYIGY
- Description：IC FLASH 512MBIT SPI/QUAD 8WSON
- Series：GD55WB
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：512Mbit
- Memory Organization：64M x 8
- Memory Interface：SPI - Quad I/O
- Clock Frequency：104 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：1.65V ~ 3.6V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-WDFN Exposed Pad
- Supplier Device Package：8-WSON (6x8)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD55WB512MEYIGY
Memory IC Overview
The GD55WB512MEYIGY is a 512 Mbit SPI NOR Flash memory IC manufactured by GigaDevice. It features Quad I/O, QPI, and DTR interface modes with a maximum clock frequency of 104 MHz. The device operates within a supply voltage range of 1.65 V to 3.6 V and supports a storage organization of 64 M x 8 bits. It is housed in an 8-WSON (6x8) package and functions reliably across a temperature range of -40°C to +85°C.
Memory IC Feature Summary
- Supports high-speed data transfer via Quad I/O, QPI, and DTR interface protocols
- Provides non-volatile code storage for firmware and boot applications
- Operates with flexible voltage requirements suitable for various system designs
Memory IC Applications
- Mobile devices including smartphones and tablets
- Camera modules and touch controllers
- Fingerprint sensors and AMOLED displays
Memory IC Procurement Notes
Verify the specific suffix 'W' indicates the wider voltage range compared to standard variants. Confirm the 104 MHz speed grade matches design requirements. Ensure the 8-WSON package footprint aligns with PCB layout specifications. Check current availability status as supply constraints may affect lead times.
Memory IC Selection Notes
Select this component when a balance between performance and power efficiency is required for mobile applications. The wider voltage range offers flexibility for systems with varying power rails. Consider the 8-WSON package size for space-constrained designs. Verify compatibility with existing bootloader software for seamless integration.
Memory IC Part Context
This part belongs to the GD55WB series, which targets mobile solutions. It complements GigaDevice's broader portfolio of flash memory products designed for consumer electronics and automotive sectors. The series emphasizes reliability and scalability for embedded applications requiring efficient code storage.
Memory IC Replacement Considerations
Check for pin-compatible alternatives within the GD25B or GD55 series if different speed grades are acceptable. Verify that substitute parts support the same interface modes and voltage ranges. Ensure any replacement maintains the required operating temperature range and package dimensions.
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