Memory IC GD55X01GEB2RY product image

GD55X01GEB2RY

$16.14
  • Description:IC FLASH 1GBIT SPI/OCT
  • Series:GD55X
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray

SKU:7ce8020c0246 Category: Brand:

  
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GD55X01GEB2RY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 1GBIT SPI/OCT. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD55X01GEB2RY

  • Description:IC FLASH 1GBIT SPI/OCT
  • Series:GD55X
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:1Gbit
  • Memory Organization:128M x 8
  • Memory Interface:SPI - Octal I/O, DTR
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:24-TBGA
  • Supplier Device Package:24-TFBGA (6x8)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD55X01GEB2RY

GD55X01GEB2RY

Memory IC Overview

The GD55X01GEB2RY is a 1 Gbit SPI NOR Flash memory device manufactured by GigaDevice. It utilizes a TFBGA-24 surface-mount package and operates within a supply voltage range of 2.7 V to 3.6 V. The component supports an SPI interface with a maximum clock frequency of 166 MHz. It is designed for industrial applications, featuring a wide operating temperature range from -40°C to +105°C.

Memory IC Feature Summary

  • Supports high-speed serial peripheral interface (SPI) communication with clock frequencies up to 166 MHz.
  • Provides non-volatile data storage with a density of 1 Gbit in a compact TFBGA-24 package.
  • Engineered for reliable operation across extended industrial temperature ranges.

Memory IC Applications

  • Industrial control systems requiring robust code storage
  • Consumer electronics firmware storage
  • IoT device application programming

Memory IC Procurement Notes

Verify the specific suffix 'B2RY' against the manufacturer's official datasheet to confirm pinout and electrical characteristics match your design requirements. Ensure compatibility with your PCB footprint for the TFBGA-24 package. Confirm that the 2.7V to 3.6V voltage range aligns with your system power rails before finalizing procurement.

Memory IC Selection Notes

Select this component when a 1 Gbit capacity is required for code execution or data storage in space-constrained designs. The TFBGA-24 package offers a small form factor suitable for dense PCB layouts. Consider the 166 MHz speed for applications demanding rapid boot times or high-throughput data access within the specified industrial temperature limits.

Memory IC Part Context

This part belongs to the GD55 series of SPI NOR Flash memories from GigaDevice. The series targets diverse market segments including consumer electronics and industrial applications. These products are designed to offer high performance and reliability, supporting various densities and package options to meet different design constraints.

Memory IC Replacement Considerations

Check for alternative parts within the GD55 series with compatible pinouts and electrical specifications. Verify that any substitute maintains the same 1 Gbit density, TFBGA-24 package, and industrial temperature rating to ensure drop-in compatibility without redesigning the hardware.

Memory IC FAQ

What is the maximum operating clock frequency?

The maximum clock frequency is 166 MHz.

What is the operating temperature range?

The device operates between -40°C and +105°C.

GD55X01GEB2RYGD55X01GEB2RY
$16.14
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