Memory IC GD55X01GEFIRR product image

GD55X01GEFIRR

$10.17
  • Description:IC FLASH 1GBIT SPI/OCT
  • Series:GD55X
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:eb132b5d028e Category: Brand:

  
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GD55X01GEFIRR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 1GBIT SPI/OCT. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD55X01GEFIRR

  • Description:IC FLASH 1GBIT SPI/OCT
  • Series:GD55X
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:1Gbit
  • Memory Organization:128M x 8
  • Memory Interface:SPI - Octal I/O, DTR
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:16-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package:16-SOP
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD55X01GEFIRR

GD55X01GEFIRR

Memory IC Overview

The GD55X01GEFIRR is a 1 Gbit NOR flash memory device manufactured by GigaDevice. It utilizes a Serial Peripheral Interface (SPI) with a maximum clock frequency of 166 MHz. The component operates within a supply voltage range of 2.7 V to 3.6 V and supports surface mount installation in an SOP-16 package. It functions reliably across a temperature range of -40°C to +85°C.

Memory IC Feature Summary

  • Provides non-volatile code storage for embedded systems
  • Supports standard SPI interface protocols
  • Designed for surface mount technology integration

Memory IC Applications

  • Embedded system firmware storage
  • Consumer electronics code execution
  • Industrial control system booting

Memory IC Procurement Notes

Verify the specific suffix 'EFIRR' against the official manufacturer datasheet to confirm package type, tape and reel specifications, and regional compliance certifications. Ensure the ordering quantity aligns with factory packaging requirements. Confirm that the 3V operating voltage matches the target system design constraints before procurement.

Memory IC Selection Notes

Select this component when a 1 Gbit capacity is required with standard SPI compatibility. It is suitable for designs needing a 16-pin SOP package and operation up to 166 MHz. Consider alternative packages like TFBGA if space constraints require a smaller footprint or higher pin count interfaces are needed.

Memory IC Part Context

This part belongs to the GD55 series of SPI NOR flash memories from GigaDevice. The series targets diverse market segments with densities ranging from 512Kb to 2Gb. These devices are designed to deliver high performance and reliability for consumer and industrial applications requiring efficient code storage solutions.

Memory IC Replacement Considerations

Check for GD55X01GEB2RY for a TFBGA-24 package variant. Verify GD55B01GEFIRR for similar 1 Gbit capacity with potentially different thermal ratings or interface support.

GD55X01GEFIRRGD55X01GEFIRR
$10.17
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