ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
GD55X02GEB2RY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD55X02GEB2RY
- Description：IC FLASH
- Series：-
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tray
- Memory Type：-
- Memory Format：FLASH
- Technology：FLASH - NOR
- Memory Size：-
- Memory Organization：-
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD55X02GEB2RY
Memory IC Overview
The GD55X02GEB2RY is a 2 Gbit NOR flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 2.7 V to 3.6 V and supports DTR SPI, OPI, and standard SPI interfaces. The component features a maximum clock frequency of 200 MHz with synchronous timing. Designed for surface mount installation, it functions reliably across an operating temperature range of -40°C to +105°C.
Memory IC Feature Summary
- Supports high-speed data transfer via DTR SPI and OPI interface modes
- Provides robust code storage capabilities for embedded systems
- Ensures reliable operation in industrial temperature environments
Memory IC Applications
- Mobile device camera modules
- Smartphone touch controllers
- Fingerprint sensor data storage
- AMOLED display control systems
Memory IC Procurement Notes
Verify availability status directly with authorized distributors as supply may be restricted. Confirm the specific package type and lead times prior to order placement. Ensure compatibility with existing system voltage requirements and interface protocols. Review RoHS compliance documentation for regulatory adherence. Validate that the component meets the required industrial temperature specifications for the intended deployment environment.
Memory IC Selection Notes
Select this component when a 2 Gbit density is required for mobile or IoT applications. Ensure the design supports DTR or OPI interfaces to utilize the 200 MHz clock capability. Verify that the PCB layout accommodates the SMD/SMT package form factor. Confirm that the system power supply remains stable within the 2.7 V to 3.6 V operational window.
Memory IC Part Context
This part belongs to the GD55 series of SPI NOR flash memories from GigaDevice. The series targets high-performance mobile solutions, offering flexible options for optimizing power consumption and battery life. It complements the manufacturer's portfolio of MCUs and sensors for smartphones and connected devices.
Memory IC Replacement Considerations
Check for alternative densities within the GD55 family if capacity requirements differ. Verify pinout compatibility before substituting with other GigaDevice NOR flash parts. Ensure interface support matches the target system controller capabilities.
Explore related parts through Memory, Integrated Circuits (ICs), all product categories, ChipApex homepage.
