GD5F2GQ5UEZIGY

Memory IC Overview

The GD5F2GQ5UEZIGY is a 2 Gbit SLC NAND Flash memory device manufactured by GigaDevice. It utilizes a TFBGA-24 package and operates on a single power supply voltage ranging from 2.7 V to 3.6 V. The device features an SPI interface with support for standard, dual, quad, and DTR modes, achieving a maximum clock frequency of 104 MHz at 3.3V. It offers a page size of 2048 bytes plus 128 bytes of spare area when internal ECC is disabled. The memory organization consists of 256 M x 8 bits across 2048 blocks. Active read current is limited to 40 mA, with a standby current of 50 uA. Operating temperatures range from -40°C to +85°C.

Memory IC Feature Summary

• Supports multiple SPI communication modes including standard, dual, quad, and double data rate (DTR) operations for flexible data transfer rates.
• Includes an internal Error Correction Code (ECC) engine capable of correcting up to 4 bits per 528 bytes, which can be enabled or disabled by the user.
• Features a cache register architecture that enables fast random reads and background program/erase operations to improve throughput.
• Provides hardware and software write protection mechanisms via the WP# pin and feature registers to secure data integrity.

Memory IC Applications

• Embedded systems requiring high-density non-volatile code storage
• Consumer electronics devices needing cost-effective flash solutions
• Industrial control applications with moderate temperature requirements
• IoT devices utilizing low-pin-count interfaces for space-constrained designs

Memory IC Procurement Notes

Verify the specific ordering suffix ZIG corresponds to the TFBGA-24 package type and industrial temperature grade (-40°C to +85°C). Confirm that the E version designation aligns with the required page size configuration (2K+128B). Ensure compatibility with host controllers supporting the specified SPI command set and voltage levels before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 2 Gbit capacity is required in a compact TFBGA-24 footprint. It is suitable for designs operating within the 2.7 V to 3.6 V voltage range. Consider this part if the application benefits from internal ECC handling and supports DTR Quad I/O interfaces for high-speed data access. Verify that the host system can manage the specific command sequences for cache-based operations.

Memory IC Part Context

This device belongs to the GD5F2GQ5UE series of SPI NAND Flash memories from GigaDevice. The series is designed to offer a high-performance alternative to SPI NOR and parallel NAND flashes. The UE variant specifically denotes the 3.3V operation range. The ZIG suffix identifies the physical package and thermal characteristics distinct from other form factors like WSON or BGA variants within the same density family.

Memory IC Replacement Considerations

GD5F2GQ5UEBIG: Same electrical specifications but uses a TFBGA-24 (5x5 ball array) package instead of the 4x6 array.

Memory IC FAQ

How does the internal ECC affect the usable page size?

When internal ECC is enabled (default), the page size is 2048 bytes plus 64 bytes of spare area. When disabled, the page size remains 2048 bytes but includes 128 bytes of spare area.

What is the function of the DQS pin in the TFBGA-24 package?

The DQS pin provides a Data Strobe Signal output specifically for DTR Quad I/O operations to assist in data capture at the receiver.