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GD5F4GQ4RCYIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 4GBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD5F4GQ4RCYIGR
- Description：IC FLASH 4GBIT SPI/QUAD 8WSON
- Series：-
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND
- Memory Size：4Gbit
- Memory Organization：512M x 8
- Memory Interface：SPI - Quad I/O
- Clock Frequency：120 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：1.7V ~ 2V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-WDFN Exposed Pad
- Supplier Device Package：8-WSON (6x8)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD5F4GQ4RCYIGR
Memory IC Overview
The GD5F4GQ4RCYIGR is a non-volatile SPI NAND Flash memory component manufactured by GigaDevice. It offers a storage capacity of 4Gb, organized as 512M x 8 bits. The device utilizes a Quad I/O SPI interface and operates with a clock frequency of 120 MHz. It supports a supply voltage range of 2.7V to 3.6V and functions within an industrial temperature range of -40°C to 85°C. The component is housed in an 8-WSON (6x8) package with exposed pads.
Memory IC Feature Summary
- Non-volatile data retention capability for reliable code storage
- Quad I/O SPI interface for efficient data transfer
- Industrial-grade operational stability across wide temperature ranges
Memory IC Applications
- Embedded systems requiring high-density code storage
- Consumer electronics firmware storage
- IoT devices needing compact non-volatile memory solutions
Memory IC Procurement Notes
Verify the specific suffix 'RCYIGR' against official GigaDevice documentation to confirm exact pinout and electrical characteristics. Confirm availability status as this part number may be discontinued or superseded by newer revisions within the GD5F4GQ4 family. Ensure compatibility with existing board designs regarding the 8-WSON package dimensions and exposed pad thermal requirements.
Memory IC Selection Notes
Select this component when a 4Gb density SPI NAND Flash is required for embedded applications. Consider the 120 MHz interface speed and 8-WSON footprint for space-constrained designs. Verify that the 2.7V-3.6V supply range aligns with the system power architecture. Compare against other GD5F series variants if different densities or package options are needed.
Memory IC Part Context
This part belongs to the GigaDevice GD5F SPI NAND Flash family, which provides cost-effective, high-density storage solutions. The GD5F series is built on advanced process nodes to ensure reliability and performance for various embedded applications. GigaDevice offers extensive support for this family through comprehensive datasheets and selection guides.
Memory IC Replacement Considerations
Check for direct replacements within the GD5F4GQ4 series, such as GD5F4GQ4UCYIGR or GD5F4GQ4REYIGR, ensuring identical pinouts and specifications. Consult GigaDevice's official cross-reference tools for verified substitutes if the specific suffix is unavailable.
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