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GD5F4GQ4UCYIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 4GBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.
The GD5F4GQ4UCYIGR is a non-volatile NAND flash memory integrated circuit manufactured by GigaDevice. It offers a storage capacity of 4 Gbit organized as 512M x 8 bits. The device utilizes an SPI interface with Quad I/O support and operates at a maximum clock frequency of 120 MHz. It functions within a supply voltage range of 2.7 V to 3.6 V and supports surface mount installation in an 8-WSON package measuring 6x8 mm.
Verify the current manufacturing status before procurement, as this specific part number is listed as obsolete or end-of-life in distributor records. Confirm availability of recommended manufacturer substitutes such as the GD5F4GM8UEYIGR if active inventory is required. Ensure the replacement part matches the original pinout and electrical specifications to maintain system compatibility without redesign.
Select this component when a 4 Gbit density is required in an 8-pin WSON form factor. The Quad I/O SPI interface provides a balance between pin count efficiency and throughput. Verify that the host controller supports the necessary SPI modes and that the operating environment stays within the specified industrial temperature limits and voltage ranges for reliable performance.
This component belongs to the GD5F4GQ4 series of SPI NAND flash memories from GigaDevice. These devices are designed for applications demanding high density in small packages. The series typically includes variants with different packaging options and suffixes indicating specific revisions or environmental ratings, all sharing the core 4 Gbit architecture and SPI interface capabilities.
The GD5F4GM8UEYIGR is identified as a manufacturer-recommended substitute for the obsolete GD5F4GQ4UCYIGR. Engineers should verify that the physical dimensions and pin configuration of the replacement part are compatible with the existing PCB footprint to ensure seamless integration.
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