GD5F4GQ6RF9IGY

Memory IC Overview

The GD5F4GQ6RF9IGY is a 4Gb SPI NAND Flash memory device manufactured by GigaDevice. It features an 80 MHz clock frequency and supports Quad I/O interface operations. The memory organization is specified as 512M x 8 bits. The component operates within a supply voltage range of 1.7V to 2V and is designed for industrial temperature applications ranging from -40°C to 85°C. It is housed in an 8-LGA (6x8) package with exposed pads, suitable for surface mount technology.

Memory IC Feature Summary

• Supports high-speed Quad I/O SPI interface for efficient data transfer
• Provides non-volatile flash storage with robust reliability for embedded systems
• Engineered for industrial temperature ranges to ensure stable operation

Memory IC Applications

• Embedded firmware storage in consumer electronics
• Data logging applications requiring reliable non-volatile memory
• Edge computing devices needing compact code storage solutions

Memory IC Procurement Notes

Verify current availability status as the part may be discontinued or subject to production changes. Confirm package compatibility and voltage requirements against design specifications. Check for official product change notifications or end-of-life notices from GigaDevice before finalizing procurement plans.

Memory IC Selection Notes

Select this component for designs requiring 4Gb density with low pin count and industrial temperature tolerance. Ensure power supply rails support the 1.7V to 2V operating range. Consider the 8-LGA package dimensions for PCB layout constraints and thermal management requirements during integration.

Memory IC Part Context

This part belongs to the GD5F series of SPI NAND Flash memories from GigaDevice. The series utilizes advanced process nodes to deliver high density and cost efficiency. It is positioned as a solution for applications needing higher storage capacity than NOR flash while maintaining simple interface connectivity.

Memory IC Replacement Considerations

GD5F4GQ6UEYIGR: Similar 4Gb SPI NAND in WSON-8 package. GD5F4GQ6REYIGR: Alternative variant with different suffix indicating potential package or tape/reel differences. Verify electrical parameters and physical footprint compatibility before substitution.