GD9FS1G8F2AMGI

$2.47

Description：IC FLASH 1GBIT 48TSOP I
Series：-
Mfr：GigaDevice Semiconductor (HK) Limited
Package：Tray

SKU:8690afc5cd9a Category: Memory IC Brand: GigaDevice Semiconductor (HK) Limited

Consult the customer manager about the wholesale price.

consultation hotline：86-132-6715-2157

email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.

Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Product introduction

GD9FS1G8F2AMGI is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 1GBIT 48TSOP I. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD9FS1G8F2AMGI

Description：IC FLASH 1GBIT 48TSOP I
Series：-
Mfr：GigaDevice Semiconductor (HK) Limited
Package：Tray
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NAND
Memory Size：1Gbit
Memory Organization：128M x 8
Memory Interface：-
Clock Frequency：-
Write Cycle Time - Word, Page：-
Voltage - Supply：1.7V ~ 1.95V
Operating Temperature：-
Mounting Type：Surface Mount
Package / Case：48-TFSOP (0.173", 4.40mm Width)
Supplier Device Package：48-TSOP I
Access Time：-
Grade：-
Qualification：-

Memory IC datasheet and documents for GD9FS1G8F2AMGI

GD9FS1G8F2AMGI

Memory IC Overview

The GD9FS1G8F2AMGI is a 1Gbit Single Level Cell (SLC) NAND flash memory manufactured by GigaDevice. It features an 8-bit parallel interface compliant with ONFI 1.0 standards and operates within a supply voltage range of 1.7V to 1.95V. The device is housed in a 48-lead TSOP-I package and supports an industrial temperature range from -40°C to +85°C. Key electrical parameters include a maximum standby current of 50µA, a typical page program time of 300µs, and a typical block erase time of 3ms. The memory organization consists of 1024 blocks, each containing 64 pages of 2K+128 bytes.

Memory IC Feature Summary

Supports ONFI 1.0 compatible parallel interface for standard host integration
Provides extended reliability with 100K program/erase cycles when utilizing Error Correcting Code
Includes on-chip write controller to automate programming and erasing algorithms
Features CE# Don't Care option to simplify system interface design

Memory IC Applications

Industrial embedded systems requiring high durability
Consumer electronics storage solutions
Automotive-grade applications meeting specific environmental standards
Mobile device components such as camera modules and touch controllers

Memory IC Procurement Notes

Verify the specific ordering suffix against the manufacturer's official datasheet to ensure correct voltage and package configuration. Confirm that the intended application environment falls within the specified industrial temperature range. Ensure the host controller supports the required ONFI 1.0 command set and timing specifications for reliable operation.

Memory IC Selection Notes

Select this component for designs requiring 1Gbit density with an 8-bit parallel interface. It is suitable for applications needing robust endurance and long-term data retention. Consider the 48-TSOP package constraints during PCB layout. Verify compatibility with the system's power supply voltage levels before implementation.

Memory IC Part Context

This part belongs to the GD9Fx1GxF2A series, which includes variants with different voltages and packages. The 'S' suffix indicates the 1.8V operating voltage range, while 'M' denotes the TSOP-I package. Other series members may offer 3.3V options or FBGA packaging for different form factor requirements.