Memory IC GD9FS1G8F2DDGI product image

GD9FS1G8F2DDGI

$2.15
  • Description:IC FLASH 1GBIT PAR 48FBGA
  • Series:GD9F
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray

SKU:01be6155454f Category: Brand:

  
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GD9FS1G8F2DDGI is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 1GBIT PAR 48FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD9FS1G8F2DDGI

  • Description:IC FLASH 1GBIT PAR 48FBGA
  • Series:GD9F
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (SLC)
  • Memory Size:1Gbit
  • Memory Organization:128M x 8
  • Memory Interface:ONFI
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:20ns, 600µs
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:48-VFBGA
  • Supplier Device Package:48-FBGA (6x8)
  • Access Time:16 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD9FS1G8F2DDGI

GD9FS1G8F2DDGI

Memory IC Overview

The GD9FS1G8F2DDGI is a 1 Gbit Single Level Cell (SLC) NAND flash memory manufactured by GigaDevice. It features an asynchronous parallel interface with an 8-bit data bus width and a storage organization of 128 M x 8. The device operates within a supply voltage range of 1.7 V to 1.95 V and supports an active read current of up to 25 mA. It is housed in a 48-ball FBGA package designed for surface-mount technology. The component functions reliably across an industrial temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Asynchronous parallel interface architecture supporting standard NAND protocols
  • Single-level cell (SLC) technology ensuring high endurance and reliability
  • Integrated bad block management capabilities for robust data integrity

Memory IC Applications

  • Industrial control systems requiring reliable non-volatile storage
  • Consumer electronics devices utilizing parallel NAND interfaces
  • Embedded systems needing compact, high-density memory solutions

Memory IC Procurement Notes

Verify the specific suffix DDGI against official datasheets to confirm package type and temperature grade. Confirm RoHS compliance status through manufacturer documentation. Check for restricted availability or allocation constraints directly with authorized distributors. Ensure compatibility with system voltage levels between 1.7 V and 1.95 V before integration.

Memory IC Selection Notes

Select this component when a parallel interface is required rather than SPI or QSPI alternatives. Consider the 48-ball FBGA package constraints during PCB layout design. Evaluate the 1.7 V to 1.95 V operating voltage against system power rails. Compare performance metrics with other GD9F series variants if different package options are needed.

Memory IC Part Context

This part belongs to the GD9F series of parallel NAND flash memories from GigaDevice. The series offers various capacities and package options tailored for diverse storage needs. The GD9FS1G8F2DDGI specifically provides 1 Gbit density in a compact form factor suitable for space-constrained applications requiring parallel access speeds.

Memory IC Replacement Considerations

Check for exact pin-to-pin compatible replacements within the GD9FS1G8 family. Verify if alternative suffixes offer identical electrical characteristics with different packaging. Consult official cross-reference lists for validated substitutes.

GD9FS1G8F2DDGIGD9FS1G8F2DDGI
$2.15
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