Memory IC GD9FS1G8F2DLGI product image

GD9FS1G8F2DLGI

$2.27
  • Description:IC FLASH 1GBIT PAR 63FBGA
  • Series:GD9F
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray

SKU:40a6e5bf95ee Category: Brand:

  
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GD9FS1G8F2DLGI is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 1GBIT PAR 63FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD9FS1G8F2DLGI

  • Description:IC FLASH 1GBIT PAR 63FBGA
  • Series:GD9F
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (SLC)
  • Memory Size:1Gbit
  • Memory Organization:128M x 8
  • Memory Interface:ONFI
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:20ns, 600µs
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:63-VFBGA
  • Supplier Device Package:63-FBGA (9x11)
  • Access Time:16 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD9FS1G8F2DLGI

GD9FS1G8F2DLGI

Memory IC Overview

The GD9FS1G8F2DLGI is a 1 Gbit Parallel NAND Flash memory component manufactured by GigaDevice. It utilizes Single Level Cell (SLC) technology and features an 8-bit data bus width with a storage organization of 128M x 8. The device operates within a supply voltage range of 1.7V to 1.95V and supports surface mount installation in a 63-VFBGA package measuring 9x11 mm. It is designed for industrial temperature ranges, functioning reliably between -40°C and +85°C ambient temperatures.

Memory IC Feature Summary

  • Supports parallel interface architecture for high-speed data transfer
  • Utilizes Single Level Cell (SLC) NAND technology for reliable non-volatile storage
  • Integrated bad block management functionality for enhanced data integrity

Memory IC Applications

  • Mobile devices including smartphones and tablets
  • Camera modules and touch controllers
  • Fingerprint sensors and AMOLED displays

Memory IC Procurement Notes

Verify the specific suffix DLGI against official datasheets to confirm pinout and electrical characteristics match design requirements. Confirm RoHS compliance status and moisture sensitivity level prior to assembly. Check current availability as supply may be restricted in certain regions. Ensure ESD protection protocols are followed during handling and soldering processes.

Memory IC Selection Notes

Select this component when a parallel interface is required for high-bandwidth applications. Consider the 63-VFBGA package size for board space constraints. Verify that the 1.7V to 1.95V operating voltage aligns with the system power rails. Evaluate thermal performance within the specified -40°C to +85°C range for the intended environment.

Memory IC Part Context

This part belongs to the GD9F series of parallel NAND flash memories from GigaDevice. The series is characterized by high capacity and performance, targeting mobile and industrial solutions. It complements other GigaDevice offerings such as SPI NOR and QSPI NAND flashes, providing diverse storage options for various design architectures.

Memory IC Replacement Considerations

Check for compatible parts within the GD9FS1G8 family with different suffixes. Verify pin compatibility and electrical specifications before substitution.

GD9FS1G8F2DLGIGD9FS1G8F2DLGI
$2.27
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