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GD9FS1G8F3ALGI is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC MEMORY. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD9FS1G8F3ALGI
- Description：IC MEMORY
- Series：-
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tray
- Memory Type：-
- Memory Format：-
- Technology：-
- Memory Size：-
- Memory Organization：-
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD9FS1G8F3ALGI
Memory IC Overview
The GD9FS1G8F3ALGI is a 1 Gbit parallel NAND flash memory IC manufactured by GigaDevice. It features an 8-bit data bus width and a storage organization of 128M x 8. The device operates within a supply voltage range of 1.7V to 1.95V and supports an access time of 30 ns with a page write cycle time of 45 ns. It is housed in a 63-VFBGA package measuring 9x11 mm and is designed for surface mount installation. The component functions reliably across an industrial temperature range of -40°C to +85°C.
Memory IC Feature Summary
- Supports parallel interface communication for high-speed data transfer
- Utilizes SLC NAND technology for reliable non-volatile data retention
- Operates at low voltage levels to optimize power consumption
- Designed for industrial-grade environmental stability
Memory IC Applications
- Mobile devices and smartphones
- Camera modules
- Touch controllers
- Fingerprint sensors
- AMOLED displays
Memory IC Procurement Notes
Verify the specific suffix 'F3' against the official datasheet to confirm pinout and command set compatibility, as variations exist within the GD9FS family. Ensure the 63-FBGA footprint matches the target PCB design. Confirm that the 1.8V supply rail aligns with system requirements before integration. Check for RoHS compliance documentation if required by regional regulations.
Memory IC Selection Notes
Select this part when a parallel interface is required for 1 Gbit capacity in space-constrained mobile applications. The 63-FBGA package offers a compact solution compared to TSOP alternatives. Consider the 30 ns access time for performance needs. Verify that the host controller supports the specific parallel NAND protocol defined in the datasheet. Evaluate thermal management capabilities given the industrial temperature rating.
Memory IC Part Context
This component belongs to the GD9FS series of parallel NAND flash memories from GigaDevice. It shares architectural similarities with other parts in the GD9Fx1GxFxA family, such as the GD9FS1G8F2ALGI, but differs in package type and potentially timing characteristics. The series is targeted at mobile solutions requiring efficient storage for multimedia and sensor data.
Memory IC Replacement Considerations
GD9FS1G8F2ALGI: Different package (63-FBGA vs 63-FBGA, verify suffix meaning). GD9FS1G8F2AMGI: Different package (48-TSOP). Cross-referencing requires strict verification of pinouts and electrical parameters.
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