Memory IC GD9FS2G8F2ALGI product image

GD9FS2G8F2ALGI

$3.73
  • Description:IC FLASH 2GBIT ONFI
  • Series:GD9F
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray

SKU:576db5536543 Category: Brand:

  
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GD9FS2G8F2ALGI is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 2GBIT ONFI. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD9FS2G8F2ALGI

  • Description:IC FLASH 2GBIT ONFI
  • Series:GD9F
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (SLC)
  • Memory Size:2Gbit
  • Memory Organization:256M x 8
  • Memory Interface:ONFI
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:25ns
  • Voltage - Supply:1.7V ~ 1.95V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:63-VFBGA
  • Supplier Device Package:63-FBGA (9x11)
  • Access Time:20 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD9FS2G8F2ALGI

GD9FS2G8F2ALGI

Memory IC Overview

The GD9FS2G8F2ALGI is a 2 Gbit parallel NAND flash memory component manufactured by GigaDevice. It utilizes Single Level Cell (SLC) technology and supports an x8 data bus organization with a page size of 2K + 128 bytes. The device operates within a supply voltage range of 1.7V to 1.95V and features an industrial temperature rating from -40°C to 85°C. It is housed in a 63-ball FBGA package measuring 9mm x 11mm. Key performance specifications include a maximum random read time of 25ns, a typical page program time of 300us, and a typical block erase time of 3ms.

Memory IC Feature Summary

  • Supports ONFI 1.0 standard interface for compatibility
  • Enables multi-plane operations for concurrent processing
  • Includes cache read functionality to improve throughput
  • Provides hardware write protection via the WP# pin

Memory IC Applications

  • Mobile devices requiring high-density storage
  • Consumer electronics with industrial temperature requirements
  • Embedded systems utilizing parallel NAND interfaces

Memory IC Procurement Notes

Verify that the ordering suffix 'L' corresponds to the specific 63-FBGA package variant as defined in the manufacturer's part numbering scheme. Confirm that the system power supply strictly adheres to the 1.7V to 1.95V operating range specified for the GD9FS series. Ensure the host controller supports the required command set and timing parameters for reliable operation.

Memory IC Selection Notes

Select this component when a 2 Gbit capacity with SLC reliability is required for industrial environments. The low voltage operation makes it suitable for battery-powered applications. Compare against the GD9FU series if a higher 2.7V to 3.6V supply voltage is necessary for the target design. Consider the 63-FBGA footprint constraints during PCB layout.

Memory IC Part Context

This part belongs to the GD9Fx2GxF2A family, which includes variants with different voltages and packages. The GD9FS designation indicates the low-voltage 1.8V class, while GD9FU denotes the 3.3V class. The '2G' specifies the 2 Gbit density, and '8' indicates the x8 bus width. This family supports both TSOP-48 and FBGA-48 packages in addition to the FBGA-63.

Memory IC Replacement Considerations

GD9FS2G8F2AMGI

Memory IC FAQ

How does the CE# Don't Care feature function?

The CE# signal can be held high or toggled without interrupting the read operation, provided the RE# clock continues to toggle. This simplifies the system interface and allows direct code execution from the device.

What is the mechanism for identifying defective blocks?

Defective blocks are marked by setting the first byte of the user data or spare area in the first or last page of the block to a non-FFh value. The host must check these locations to build a bad block table before programming.

GD9FS2G8F2ALGIGD9FS2G8F2ALGI
$3.73
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