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GD9FS4G8F2AMGI is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 4GBIT ONFI 48TSOPI. Review the specifications below when checking this part for your BOM.
The GD9FS4G8F2AMGI is a NAND flash memory component manufactured by GigaDevice. It features a storage capacity of 4 Gbit with an organization of 128 M x 8 and an 8-bit data bus width. The device utilizes a parallel interface and operates within a supply voltage range of 1.7 V to 1.95 V, with a maximum active read current of 30 mA. It is housed in a 63-ball FBGA package designed for surface mount technology. The component supports an industrial temperature range from -40°C to +85°C and holds MSL 3 moisture sensitivity certification.
Verify the specific package variant against design requirements, as the GD9FS series includes both TSOP and FBGA options. Confirm that the 1.7V to 1.95V supply voltage aligns with the target system's power rails. Ensure compliance with RoHS3 standards and MSL 3 handling procedures during manufacturing. Cross-reference the manufacturer part number with official distributor catalogs to avoid confusion with similar density variants.
Select this component when a 4 Gbit parallel NAND solution is required for industrial-grade applications. The FBGA package offers a compact footprint suitable for space-constrained designs. Consider the 8-bit interface width if board routing complexity allows for parallel connections. Verify thermal performance within the specified -40°C to +85°C range for the intended operating environment.
This part belongs to the GD9FS series of parallel NAND flash memories from GigaDevice. The series targets industrial and mobile applications requiring high reliability and durability. It complements other GigaDevice storage solutions like SPI NOR and QSPI NAND flashes, providing a parallel interface option for legacy or high-bandwidth system architectures.
Check for direct pin-compatible substitutes within the GD9FS family, such as different density variants like GD9FS1G8F2AMGI, ensuring the package type matches. Verify electrical specifications and organizational structure before substitution.
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