GD9FS4G8F3AMGI

Memory IC Overview

The GD9FS4G8F3AMGI is a non-volatile NAND flash memory component manufactured by GigaDevice. It features a storage capacity of 4 Gbit with an organization of 128 M x 8 and an 8-bit data bus width. The device utilizes a parallel interface and is housed in an FBGA-63 package. It operates within a voltage range of 1.7 V to 1.95 V, with a maximum active read current of 30 mA. The operational temperature range spans from -40 C to +85 C.

Memory IC Feature Summary

• Non-volatile NAND flash memory technology for persistent data retention
• Parallel interface supporting high-speed data transfer operations
• Surface-mount installation style suitable for automated assembly processes

Memory IC Applications

• Embedded systems requiring code storage
• Consumer electronics devices
• Industrial control applications

Memory IC Procurement Notes

Verify the exact part number against official manufacturer documentation to ensure compatibility with system requirements. Confirm that the FBGA-63 package dimensions align with the printed circuit board layout. Check for specific RoHS compliance status if environmental regulations apply to the final product deployment. Ensure supply chain sources are authorized distributors to guarantee component authenticity and traceability throughout the manufacturing lifecycle.

Memory IC Selection Notes

Select this component when a 4 Gbit density with parallel interface is required for embedded storage solutions. The 1.8V power supply specification suits low-voltage designs. Consider the FBGA-63 package for compact form factors. Verify thermal performance within the specified industrial temperature range during system design. Compare against other densities in the GD9FS series if capacity requirements differ.

Memory IC Part Context

This component belongs to the GigaDevice NAND Flash portfolio, designed for reliable data storage in various electronic applications. The GD9FS series offers scalable storage options with parallel interfaces. GigaDevice provides these solutions for markets including consumer electronics and industrial automation, emphasizing stability and long-term supply availability for embedded designs requiring robust non-volatile memory.

Memory IC Replacement Considerations

GD9FS2G8F3ALGI: Lower density option (2 Gbit) with similar specifications. GD9FU4G8F3AMGI: Different package type (TSOPI-48) but same capacity.