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GD9FS4G8F4DLGI is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD9FS4G8F4DLGI
- Description：IC FLASH
- Series：-
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tray
- Memory Type：-
- Memory Format：FLASH
- Technology：FLASH - NAND
- Memory Size：-
- Memory Organization：-
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD9FS4G8F4DLGI
Memory IC Overview
The GD9FS4G8F4DLGI is a NAND flash memory integrated circuit manufactured by GigaDevice. It provides a storage capacity of 4 Gbit and utilizes a parallel asynchronous interface for data communication. The device operates within a supply voltage range of 1.7 V to 1.95 V and supports a maximum active read current of 25 mA. Designed for surface mount applications, it is housed in an FBGA-63 package. The component functions reliably across an industrial temperature range from -40°C to +85°C.
Memory IC Feature Summary
- Supports parallel asynchronous interface for data transfer
- Operates with low voltage power supply between 1.7 V and 1.95 V
- Designed for surface mount installation in compact electronic assemblies
Memory IC Applications
- Data storage in embedded systems requiring non-volatile memory
- Industrial control units operating within specified temperature ranges
- Consumer electronics utilizing NAND flash technology
Memory IC Procurement Notes
Verify the specific suffix DLGI against official manufacturer documentation to confirm pinout and electrical characteristics. Ensure compatibility with system voltage requirements of 1.7 V to 1.95 V. Confirm package type FBGA-63 matches PCB layout constraints. Check RoHS compliance status through certified datasheets before integration into final products.
Memory IC Selection Notes
Select this component when a 4 Gbit NAND flash solution with parallel interface is required. Consider the FBGA-63 package size for space-constrained designs. Verify that the operating temperature range of -40°C to +85°C meets environmental specifications. Ensure the controller supports the asynchronous timing protocol defined in the technical manual.
Memory IC Part Context
This part belongs to the GD9FS series of NAND flash memories from GigaDevice. The series typically offers various capacities and interface options for different market segments. The FBGA-63 packaging indicates a high-density footprint suitable for modern portable and industrial devices. This specific model focuses on mid-range capacity with standard parallel connectivity.
Memory IC Replacement Considerations
Consult official substitution guides for compatible parts with identical pinouts and electrical parameters. Verify that alternative components support the same 4 Gbit capacity and FBGA-63 package. Ensure voltage and temperature specifications match the original design requirements.
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