ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
GD9FU1G8F2DDGI is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 1GBIT PAR 48FBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD9FU1G8F2DDGI
- Description：IC FLASH 1GBIT PAR 48FBGA
- Series：GD9F
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (SLC)
- Memory Size：1Gbit
- Memory Organization：128M x 8
- Memory Interface：ONFI
- Clock Frequency：-
- Write Cycle Time - Word, Page：12ns, 600µs
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：48-VFBGA
- Supplier Device Package：48-FBGA (6x8)
- Access Time：9 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD9FU1G8F2DDGI
Memory IC Overview
The GD9FU1G8F2DDGI is a NAND flash memory component manufactured by GigaDevice. It features a storage capacity of 1 Gbit with an organization of 128 M x 8. The device utilizes a parallel interface and asynchronous timing type. It operates within a power supply voltage range of 2.7 V to 3.6 V. The maximum active read current is specified as 30 mA. The unit is designed for surface mount installation in an FBGA-48 package. It supports an operating temperature range from -40 C to +85 C.
Memory IC Feature Summary
- Provides non-volatile data storage using NAND flash technology.
- Supports parallel data transfer via an asynchronous interface.
- Designed for surface-mount integration on printed circuit boards.
Memory IC Applications
- Data storage in embedded systems
- Consumer electronics devices
- Industrial control applications
Memory IC Procurement Notes
Verify the specific package variant and electrical specifications against the official manufacturer datasheet before integration. Confirm that the parallel interface requirements align with the host controller design. Ensure environmental conditions remain within the specified operational temperature limits during deployment.
Memory IC Selection Notes
Select this component when a 1 Gbit capacity with parallel access is required. Consider the FBGA-48 footprint constraints and the 2.7 V to 3.6 V power supply compatibility. Evaluate the asynchronous timing characteristics against system performance needs.
Memory IC Part Context
This part belongs to the GD9F series of parallel NAND flash memories offered by GigaDevice. The series provides high-capacity storage solutions for various electronic designs. Other variants in the family may differ in package type, such as TSOP or different BGA configurations, while maintaining similar core memory technologies.
Memory IC Replacement Considerations
Consult the manufacturer's cross-reference documentation for verified substitute part numbers. Ensure any alternative component matches the 1 Gbit capacity, parallel interface, and FBGA-48 package dimensions.
Explore related parts through Memory, Integrated Circuits (ICs), all product categories, ChipApex homepage.
