ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
GD9FU1G8F3AMGI is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC MEMORY. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD9FU1G8F3AMGI
- Description：IC MEMORY
- Series：GD9F
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (SLC)
- Memory Size：1Gbit
- Memory Organization：128M x 8
- Memory Interface：ONFI
- Clock Frequency：-
- Write Cycle Time - Word, Page：20ns
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：48-TFSOP (0.724", 18.40mm Width)
- Supplier Device Package：48-TSOP I
- Access Time：18 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD9FU1G8F3AMGI
Memory IC Overview
The GD9FU1G8F3AMGI is a 1 Gbit NAND flash memory integrated circuit manufactured by GigaDevice. It features a storage organization of 128M x 8 and operates within a supply voltage range of 2.7V to 3.6V. The component is housed in a 48-TSOP I surface-mount package with a width of 4.40mm. It is classified as non-volatile flash memory technology and is currently in active production status.
Memory IC Feature Summary
- Provides non-volatile data retention for embedded storage applications
- Supports standard NAND flash interface protocols for system integration
- Designed for reliable operation across specified industrial voltage ranges
Memory IC Applications
- Embedded systems requiring code or data storage
- Industrial control equipment memory modules
- Consumer electronics firmware storage
Memory IC Procurement Notes
Verify the specific suffix F3 against official datasheets to confirm pinout and electrical characteristics, as variations exist within the GD9FU family. Ensure compatibility with host controller voltage levels before integration. Confirm RoHS compliance status through manufacturer documentation prior to procurement.
Memory IC Selection Notes
Select this component when a 1 Gbit capacity with 8-bit parallel interface is required. Compare against the GD9FU1G8F2AMGI variant to determine if specific package or timing differences impact the design. Ensure the 48-TSOP footprint matches the PCB layout constraints.
Memory IC Part Context
This part belongs to the GD9FU series of NAND flash memories from GigaDevice. The series targets high-density storage needs in mobile and industrial sectors. It complements the company's SPI NOR and other NAND portfolios by offering parallel interface options for higher bandwidth requirements.
Memory IC Replacement Considerations
The GD9FU1G8F2AMGI is a related variant within the same family. Verify functional equivalence regarding interface timing and package dimensions before substitution. No other direct public substitutes are confirmed.
Explore related parts through Memory, Integrated Circuits (ICs), all product categories, ChipApex homepage.
