Memory IC GD9FU2G6F3ALGI product image

GD9FU2G6F3ALGI

$3.88
  • Description:IC FLASH 2GBIT ONFI
  • Series:GD9F
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray

SKU:c83bbfdccbed Category: Brand:

  
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GD9FU2G6F3ALGI is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 2GBIT ONFI. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD9FU2G6F3ALGI

  • Description:IC FLASH 2GBIT ONFI
  • Series:GD9F
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (SLC)
  • Memory Size:2Gbit
  • Memory Organization:128M x 16
  • Memory Interface:ONFI
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:20ns
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:63-VFBGA
  • Supplier Device Package:63-FBGA (9x11)
  • Access Time:18 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD9FU2G6F3ALGI

GD9FU2G6F3ALGI

Memory IC Overview

The GD9FU2G6F3ALGI is a 2Gbit non-volatile NAND flash memory IC manufactured by GigaDevice Semiconductor (HK) Limited. It utilizes Single-Level Cell (SLC) technology and supports the ONFI interface for data storage. The component is housed in a 63-VFBGA package, providing a compact form factor suitable for space-constrained designs. This memory device is engineered to retain firmware, boot code, and other critical data without power, ensuring reliable operation in various electronic systems.

Memory IC Feature Summary

  • Non-volatile SLC NAND flash architecture for persistent data retention
  • ONFI interface compatibility for standardized connectivity
  • Compact 63-VFBGA package design

Memory IC Applications

  • Storing firmware images
  • Boot code storage
  • General-purpose data retention

Memory IC Procurement Notes

Verify the exact datasheet version and package marking against the manufacturer's official documentation before procurement. Confirm that the 63-VFBGA footprint matches your PCB layout requirements. Ensure supply chain authenticity through authorized channels to mitigate counterfeiting risks associated with semiconductor components.

Memory IC Selection Notes

Select this component when a 2Gbit capacity with SLC endurance characteristics is required. The ONFI interface ensures interoperability with standard controllers. Evaluate the 63-VFBGA package dimensions against board space constraints. Consider thermal management requirements inherent to NAND flash operations during high-speed data transfers.

Memory IC Part Context

GigaDevice Semiconductor (HK) Limited is a global fabless supplier of integrated circuits, specializing in flash memory, MCUs, and sensors. The company provides solutions for mobile, industrial, and consumer electronics. This part belongs to their NAND flash portfolio, designed for reliable data storage applications requiring non-volatile memory capabilities.

Memory IC Replacement Considerations

Consult official GigaDevice documentation for verified substitute part numbers. Cross-reference pinouts, electrical specifications, and package dimensions before substituting. Generic equivalents may not guarantee functional compatibility or reliability.

GD9FU2G6F3ALGIGD9FU2G6F3ALGI
$3.88
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