GD9FU4G8F2AMGI

Memory IC Overview

The GD9FU4G8F2AMGI is a NAND flash memory IC manufactured by GigaDevice. It offers a storage capacity of 4 Gbit with an organization of 128 M x 8. The device utilizes the ONFI interface and operates at a read access time of 18 ns. It is housed in a 48-TSOP I package. The component supports SLC (Single-Level Cell) memory format and functions within a supply voltage range of 1.7 V to 1.95 V.

Memory IC Feature Summary

• Supports high-speed parallel data transfer via ONFI interface
• Provides non-volatile data retention for embedded applications
• Utilizes Single-Level Cell architecture for reliable storage

Memory IC Applications

• Mobile devices requiring compact storage solutions
• Embedded systems needing high-density flash memory
• Consumer electronics utilizing NAND flash components

Memory IC Procurement Notes

Verify the exact suffix against official datasheets to confirm package type and temperature grade. Ensure compatibility with system voltage requirements of 1.7 V to 1.95 V. Confirm lead times and availability through authorized distributors as stock levels fluctuate. Validate RoHS compliance status prior to integration into final products.

Memory IC Selection Notes

Select this part for designs requiring 4 Gbit capacity in a TSOP package. Compare with GD9FS series variants if FBGA packaging is preferred. Ensure the host controller supports the specific ONFI interface timing parameters. Verify that the 128 M x 8 organization aligns with the application's memory mapping requirements.

Memory IC Part Context

This component belongs to the GD9F series of parallel NAND flash memories from GigaDevice. The series is designed for high-capacity storage needs in mobile and consumer markets. It complements the company's broader portfolio including SPI NOR and QSPI NAND options, providing diverse interface choices for different system architectures.

Memory IC Replacement Considerations

Check for direct substitutes within the GD9F family such as GD9FS4G8F2ALGI for different packaging. Verify pinout compatibility when replacing with other 48-pin TSOP or FBGA NAND parts. Ensure electrical specifications match to avoid system instability.