Memory IC GD9FU4G8F3ALGI product image

GD9FU4G8F3ALGI

$5.71
  • Description:IC MEMORY
  • Series:GD9F
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray

SKU:8a07cab2a457 Category: Brand:

  
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GD9FU4G8F3ALGI is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC MEMORY. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD9FU4G8F3ALGI

  • Description:IC MEMORY
  • Series:GD9F
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (SLC)
  • Memory Size:4Gbit
  • Memory Organization:512M x 8
  • Memory Interface:ONFI
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:20ns
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:63-VFBGA
  • Supplier Device Package:63-FBGA (9x11)
  • Access Time:18 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD9FU4G8F3ALGI

GD9FU4G8F3ALGI

Memory IC Overview

The GD9FU4G8F3ALGI is a 4 Gbit parallel NAND flash memory component manufactured by GigaDevice. It features an asynchronous interface with an 8-bit data bus width and a memory organization of 128 M x 8. The device operates within a voltage range of 2.7 V to 3.6 V, with a maximum active read current of 30 mA. It is housed in an FBGA-63 package and supports an industrial operating temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Supports parallel asynchronous interface for standard NAND connectivity
  • Provides 4 Gbit storage capacity with 128 M x 8 organization
  • Operates within industrial temperature range for robust performance

Memory IC Applications

  • Mobile devices requiring non-volatile data storage
  • Consumer electronics utilizing parallel NAND interfaces
  • Industrial control systems needing wide temperature operation

Memory IC Procurement Notes

Verify the specific suffix 'I' against the manufacturer's official datasheet to confirm pinout compatibility and electrical characteristics. Ensure the design accommodates the FBGA-63 package dimensions and thermal requirements. Confirm that the 2.7V to 3.6V supply rail aligns with the system power architecture before finalizing procurement.

Memory IC Selection Notes

Select this component when a 4 Gbit capacity is required with a parallel interface rather than SPI. The industrial temperature rating makes it suitable for environments exceeding commercial limits. Compare against the GD9FS series if lower voltage operation (1.7V) is needed, noting the distinct power supply requirements between the FU and FS product lines.

Memory IC Part Context

This part belongs to the GD9FU4GxF3A series of parallel NAND flash memories. It shares the FBGA-63 form factor and asynchronous timing characteristics with other members of the family, differing primarily in density and specific voltage tolerances defined by the model suffix.

Memory IC Replacement Considerations

The GD9FU4G8F3ALGJ is a documented variant within the same series. Verify if the suffix change implies any functional or packaging differences per the official documentation before substitution.

GD9FU4G8F3ALGIGD9FU4G8F3ALGI
$5.71
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