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GD9FU4G8F3ALGJ is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD9FU4G8F3ALGJ
- Description：IC FLASH
- Series：-
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tray
- Memory Type：-
- Memory Format：FLASH
- Technology：FLASH - NAND
- Memory Size：-
- Memory Organization：-
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD9FU4G8F3ALGJ
Memory IC Overview
The GD9FU4G8F3ALGJ is a NAND flash memory component manufactured by GigaDevice. It features a storage capacity of 4 Gbit and utilizes an asynchronous parallel interface with an 8-bit data bus width. The device is organized as 128 M x 8 and operates within a voltage range of 2.7 V to 3.6 V. It supports surface mount installation in an FBGA-63 package and functions reliably across a temperature range of -40°C to +85°C, with a maximum active read current of 30 mA.
Memory IC Feature Summary
- Asynchronous parallel interface for direct system integration
- High-density 4 Gbit non-volatile storage architecture
- Industrial-grade operational temperature stability
Memory IC Applications
- Mobile device camera modules
- Touch controller data storage
- Fingerprint sensor memory buffers
- AMOLED display firmware storage
Memory IC Procurement Notes
Verify the specific suffix (e.g., ALGI vs ALGJ) against official datasheets to ensure correct packaging and regional availability. Confirm RoHS compliance status directly with the manufacturer or authorized distributors prior to ordering. Check for any regional sales restrictions that may apply to this specific part number in your location.
Memory IC Selection Notes
Select this component when an asynchronous parallel NAND interface is required for high-density storage in mobile applications. Ensure the host system supports the 8-bit data bus width and operates within the specified 2.7 V to 3.6 V power supply range. Verify that the FBGA-63 package dimensions fit the PCB layout constraints.
Memory IC Part Context
This part belongs to the GD9FU4GxF3A series of NAND flash memories designed for mobile solutions. It complements GigaDevice's portfolio of MCUs and sensors by providing reliable data storage for smartphones and portable devices. The series focuses on optimizing power consumption and extending battery life in compact electronic designs.
Memory IC Replacement Considerations
Check for GD9FU4G8F3ALGI as a potential variant with identical electrical specifications but potentially different packaging or regional distribution details. Verify pin compatibility and timing parameters before substituting.
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