GD9FU4G8F3AMGI

Memory IC Overview

The GD9FU4G8F3AMGI is a non-volatile NAND flash memory component manufactured by GigaDevice. It offers a storage capacity of 4 Gbit with an organization of 128 M x 8 and an 8-bit data bus width. The device utilizes a parallel asynchronous interface and operates within a supply voltage range of 2.7 V to 3.6 V. It supports active read currents up to 30 mA and functions reliably across an industrial temperature range from -40°C to +85°C. The component is housed in a TSOPI-48 surface-mount package.

Memory IC Feature Summary

• Provides non-volatile data retention using NAND flash technology for reliable long-term storage.
• Features an asynchronous parallel interface supporting standard 8-bit data bus operations.
• Designed for industrial-grade performance with extended operating temperature capabilities.

Memory IC Applications

• Industrial control systems requiring robust data storage
• Consumer electronics utilizing NAND flash memory
• Embedded systems needing non-volatile storage solutions

Memory IC Procurement Notes

Verify the specific suffix AMGI against official datasheets to confirm package type and electrical characteristics. Ensure compatibility with system voltage requirements of 2.7V to 3.6V. Confirm lead times and availability through authorized distributors, as stock levels may vary. Check RoHS compliance status before integration into regulated products.

Memory IC Selection Notes

Select this part when a 4 Gbit capacity with parallel interface is required. Consider the TSOPI-48 package constraints for PCB layout. Evaluate power consumption limits against system battery or supply capabilities. Compare with other GD9FU series variants if different densities or interfaces are needed.

Memory IC Part Context

This component belongs to the GD9FU series of NAND flash memories from GigaDevice. The series typically includes various densities and interface options. The GD9FU4G8F3AMGI specifically targets applications needing moderate density with parallel connectivity. It complements other memory solutions in embedded design portfolios.

Memory IC Replacement Considerations

Check for direct substitutes within the GD9FU family with matching pinouts and specifications. Verify equivalent capacity and interface types when considering alternative manufacturers. Ensure thermal and electrical parameters align with existing design constraints.