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GF1M1FBDS4R is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Amphenol Positronic. Its product description is GF1M1FBDS4R. Review the specifications below when checking this part for your BOM.
The GF1M1FBDS4R is a 2-position power connector header manufactured by Amphenol Positronic. It features male pin contacts made of copper alloy with gold plating, housed in diallyl phthalate (DAP). The component supports panel mount and through-hole termination via solder tails. Rated for 300 VAC and 7.5 A, it offers an insulation resistance of 5 GOhms. Operating temperatures range from -55°C to +125°C.
Verify the specific suffix requirements against official datasheets, as suffixes may denote housing material or plating variations. Confirm that the selected variant matches the required current and voltage ratings for the target application. Ensure compatibility with mating connectors regarding pin configuration and shell size. Cross-reference part numbers with manufacturer documentation to avoid substitution errors.
Select this connector when high-density power delivery is required in constrained spaces. The 2-position layout suits applications needing minimal footprint while maintaining 7.5 A capacity. Consider the DAP housing for thermal stability. Ensure the panel mount style aligns with the enclosure design. Verify that the through-hole soldering process meets the specified temperature profiles.
This component belongs to the Mach-D series of high-performance D-Sub connectors designed for demanding environments. The series emphasizes superior EMI shielding and robustness through precision machined shells. It meets or exceeds M24308 Group B testing requirements, ensuring suitability for critical military and aerospace applications where reliability is paramount.
No direct substitute part numbers are publicly confirmed for this specific model. When replacing, ensure the new component matches the 2-position count, 7.5 A rating, and 300 VAC specification. Verify that the mounting style and termination method remain compatible with the existing PCB and panel layout.
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