Memory IC GS4288C36GL-18I product image

GS4288C36GL-18I

  • Description:IC DRAM 288MBIT PARALLEL 144UBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:3b5591f07062 Category: Brand:

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GS4288C36GL-18I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC DRAM 288MBIT PARALLEL 144UBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS4288C36GL-18I

  • Description:IC DRAM 288MBIT PARALLEL 144UBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:LLDRAM2
  • Memory Size:288Mbit
  • Memory Organization:8M x 36
  • Memory Interface:Parallel
  • Clock Frequency:533 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:144-TFBGA
  • Supplier Device Package:144-uBGA (18.5x11)
  • Access Time:-

Memory IC datasheet and documents for GS4288C36GL-18I

GS4288C36GL-18I

Memory IC Overview

The GS4288C36GL-18I is a Low Latency DRAM II synchronous dynamic random access memory component manufactured by GSI Technology. It features an organization of 16M x 18, providing a total storage capacity of 288 Mbit. The device supports DDR operation with a maximum clock frequency of 533 MHz and utilizes a 144-ball uBGA package. It operates within a voltage range of 1.7 V to 1.9 V and functions reliably across temperatures from -40°C to +95°C.

Memory IC Feature Summary

  • Supports high-speed DDR operation at frequencies up to 533 MHz for enhanced data throughput.
  • Features eight internal banks to enable concurrent operations and maximize bandwidth efficiency.
  • Incorporates a Common I/O architecture that allows flexible configuration of address and data buses.

Memory IC Applications

  • High-performance computing systems requiring low-latency memory access
  • Telecommunications infrastructure equipment
  • Network routing and switching hardware

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms industrial temperature rating compliance before procurement. Confirm the package type matches the target PCB footprint requirements. Ensure supply chain sources provide valid RoHS documentation. Cross-reference the manufacturer part number against current datasheets to confirm availability status.

Memory IC Selection Notes

Select this component when system design requires a balance between high bandwidth and reduced latency compared to standard DDR SDRAM. The 16M x 18 organization suits applications needing wide data paths. Verify power supply constraints align with the specified 1.7 V to 1.9 V operating range for optimal performance.

Memory IC Part Context

This part belongs to the GS4288C36GL series of Low Latency DRAM II devices. These components are designed to bridge the performance gap between traditional DRAM and SRAM. The series offers various organizations including 8M x 36, 16M x 18, and 32M x 9 to accommodate different interface widths.

Memory IC Replacement Considerations

Check for other speed grades within the GS4288C36GL family if timing requirements differ. Verify pin compatibility with alternative vendors offering similar LLDRAM architectures. Ensure thermal management solutions support the industrial temperature range specifications.

GS4288C36GL-18IGS4288C36GL-18I

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