Memory IC GS4576C18GM-18I product image

GS4576C18GM-18I

  • Description:IC DRAM 576MBIT HSTL 144FBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:cc63dc1f9c22 Category: Brand:

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GS4576C18GM-18I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC DRAM 576MBIT HSTL 144FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS4576C18GM-18I

  • Description:IC DRAM 576MBIT HSTL 144FBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:LLDRAM2
  • Memory Size:576Mbit
  • Memory Organization:32M x 18
  • Memory Interface:HSTL
  • Clock Frequency:533 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:144-LFBGA
  • Supplier Device Package:144-FBGA (18.5x11)
  • Access Time:-

Memory IC datasheet and documents for GS4576C18GM-18I

GS4576C18GM-18I

Memory IC Overview

The GS4576C18GM-18I is a Low Latency Dynamic Random Access Memory (LLDRAM) component manufactured by GSI Technology. It features a total storage capacity of 576 Mbit, organized as 32 M words by 18 bits. The device supports a maximum clock frequency of 533 MHz and operates within an industrial temperature range from -40°C to +95°C. Power supply requirements specify a minimum voltage of 1.7 V and a maximum of 2.63 V. The memory unit is housed in a 144-ball Fine-Pitch Ball Grid Array (FBGA) package designed for surface mount technology.

Memory IC Feature Summary

  • Provides low latency data access capabilities characteristic of LLDRAM architecture
  • Supports high-speed synchronous operation at frequencies up to 533 MHz
  • Engineered for reliable performance across extended industrial temperature environments

Memory IC Applications

  • Industrial control systems requiring robust memory solutions
  • Telecommunications infrastructure equipment
  • Automotive electronic modules operating in harsh thermal conditions

Memory IC Procurement Notes

Verify current availability status as the component lifecycle is listed as obsolete or discontinued. Confirm that the specific suffix '18I' corresponds to the required 533 MHz speed grade and industrial temperature rating. Ensure compatibility with existing PCB footprints for the FBGA-144 package before finalizing procurement plans due to potential supply chain constraints.

Memory IC Selection Notes

Select this part when low latency performance is critical alongside high bandwidth requirements in demanding environments. The 18-bit data width suits applications needing error correction or wide data buses. Verify that the system power rails can maintain stability between 1.7 V and 2.63 V. Consider the physical dimensions of the FBGA-144 package during mechanical design integration.

Memory IC Part Context

This component belongs to the GS4576C18GM series of Low Latency DRAM devices from GSI Technology. The series offers various speed grades and organizational options tailored for high-performance embedded memory needs. The '-18I' designation specifically identifies the 533 MHz operational speed and industrial temperature classification within this product family.

Memory IC Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Due to the obsolete lifecycle status, direct pin-to-pin replacements may be limited. Evaluate newer generations of LLDRAM or standard DDR SDRAM families if architectural flexibility allows.

GS4576C18GM-18IGS4576C18GM-18I

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