Memory IC GS8128218GD-250I product image

GS8128218GD-250I

$170.46
  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:9d5376895dec Category: Brand:

  
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GS8128218GD-250I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 144MBIT PAR 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8128218GD-250I

  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, Standard
  • Memory Size:144Mbit
  • Memory Organization:8M x 18
  • Memory Interface:Parallel
  • Clock Frequency:250 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.3V ~ 2.7V, 3V ~ 3.6V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS8128218GD-250I

GS8128218GD-250I

Memory IC Overview

The GS8128218GD-250I is a 144 Mbit Synchronous Burst Static Random Access Memory (SRAM) manufactured by GSI Technology. It features an 8M x 18 organization and supports dual voltage operation at 2.5V or 3.3V, with a supply range of 2.3V to 3.6V. The device achieves a maximum clock frequency of 250 MHz with a 5.5 ns access time. It utilizes a parallel interface and is housed in a 165-ball BGA package suitable for surface mount technology. The industrial temperature grade ensures reliable performance from -40°C to +100°C.

Memory IC Feature Summary

  • Supports synchronous burst read and write operations via a parallel interface
  • Compatible with both 2.5V and 3.3V power supply standards
  • Utilizes SyncBurst architecture for high-speed data transfer

Memory IC Applications

  • High-performance networking equipment requiring fast memory access
  • Industrial control systems operating in extreme temperatures
  • Telecommunications infrastructure base stations

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature rating (-40°C to +100°C) distinct from commercial variants. Confirm the 165-ball BGA footprint matches the target PCB design. Ensure the 2.5V/3.3V dual-voltage capability aligns with the system power rails. Check for moisture sensitivity labeling as indicated in official specifications.

Memory IC Selection Notes

Select this component when a 144 Mbit capacity with 18-bit width is required for synchronous applications. The 250 MHz speed and 5.5 ns latency suit high-throughput data processing tasks. The industrial temperature range makes it suitable for harsh environments where standard commercial parts would fail. The BGA package offers a compact solution for space-constrained designs.

Memory IC Part Context

This part belongs to the GS8128218GD series of SyncBurst SRAMs. It shares architectural similarities with other members like the GS8128218GD-250 but differs in its extended temperature range designation. The series is designed for applications demanding high bandwidth and low latency memory solutions within the GSI Technology portfolio.

Memory IC Replacement Considerations

Direct pin-compatible substitutes within the same family include the GS8128218GD-250, noting the difference in operating temperature range. Verify that any alternative maintains the 165-ball BGA package and 2.5V/3.3V compatibility.

GS8128218GD-250IGS8128218GD-250I
$170.46
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