Memory IC GS8128218GD-333I product image

GS8128218GD-333I

$192.98
  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:d5d6ac9a76e8 Category: Brand:

  
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GS8128218GD-333I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 144MBIT PAR 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8128218GD-333I

  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, Standard
  • Memory Size:144Mbit
  • Memory Organization:8M x 18
  • Memory Interface:Parallel
  • Clock Frequency:333 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.3V ~ 2.7V, 3V ~ 3.6V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (13x15)
  • Access Time:-

Memory IC datasheet and documents for GS8128218GD-333I

GS8128218GD-333I

Memory IC Overview

The GS8128218GD-333I is a 144 Mbit Synchronous Burst Static Random Access Memory (SRAM) manufactured by GSI Technology. It features an 8M x 18 memory organization and supports parallel interface operations at a maximum clock frequency of 333 MHz with a 4.5 ns access time. The device operates within a voltage range of 2.3 V to 3.6 V, drawing a maximum current of 410 mA or 550 mA depending on configuration. It is housed in a BGA-165 package suitable for surface mount technology and functions reliably between 0°C and +85°C.

Memory IC Feature Summary

  • Supports synchronous burst read/write operations via parallel interface
  • Capable of high-speed data transfer at up to 333 MHz clock frequency
  • Compatible with dual-voltage power supplies of 2.5V and 3.3V

Memory IC Applications

  • High-performance networking equipment requiring fast packet buffering
  • Telecommunications infrastructure systems
  • Industrial control systems demanding rapid data processing

Memory IC Procurement Notes

Verify the specific suffix 'I' indicates industrial temperature range compliance if required for your environment. Confirm the BGA-165 footprint matches your PCB design constraints. Ensure voltage levels align with the 2.3V to 3.6V operational window. Check for moisture sensitivity labeling as indicated in official documentation. Validate that the 333 MHz speed grade meets your system timing requirements before finalizing procurement.

Memory IC Selection Notes

Select this component when a large capacity SRAM with synchronous burst capabilities is needed. The 8M x 18 organization provides wide data paths suitable for complex processing tasks. Consider the BGA-165 package for compact board layouts. Ensure the operating temperature range of 0°C to +85°C fits your application environment. Compare power consumption figures against other SRAM options to optimize energy efficiency.

Memory IC Part Context

This part belongs to the GS81282 series of Synchronous Burst SRAMs from GSI Technology. These devices are designed for applications requiring high bandwidth and low latency. The series offers various density and speed grades to accommodate different system architectures. The GS8128218GD variant specifically targets high-density memory needs with a 144 Mbit capacity.

Memory IC Replacement Considerations

Check for compatible parts within the same GS81282 family, such as the GS8128218GD-250I, which offers similar specifications but at a lower clock frequency. Verify pin compatibility and electrical characteristics before substituting.

GS8128218GD-333IGS8128218GD-333I
$192.98
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