Memory IC GS81282Z18GD-250I product image

GS81282Z18GD-250I

$170.46
  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:6e88a196935b Category: Brand:

  
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GS81282Z18GD-250I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 144MBIT PAR 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS81282Z18GD-250I

  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, ZBT
  • Memory Size:144Mbit
  • Memory Organization:8M x 18
  • Memory Interface:Parallel
  • Clock Frequency:250 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.3V ~ 2.7V, 3V ~ 3.6V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS81282Z18GD-250I

GS81282Z18GD-250I

Memory IC Overview

The GS81282Z18GD-250I is a 144 Mbit Static Random Access Memory (SRAM) manufactured by GSI Technology. It features an organization of 8 Megawords by 18 bits and supports a maximum clock frequency of 250 MHz with a typical access time of 5.5 ns. The device operates on a parallel interface within a voltage range of 2.3 V to 3.6 V, drawing a maximum current of up to 490 mA. It is housed in a BGA-165 package suitable for surface mount technology and functions reliably across an industrial temperature range from -40°C to +100°C.

Memory IC Feature Summary

  • Supports NBT Pipeline and Flow Through architectures for flexible data handling
  • Includes LBO pin for configuring Linear or Interleave Burst modes
  • Features three chip enable signals to facilitate depth expansion
  • Incorporates ZZ pin functionality for automatic power-down management

Memory IC Applications

  • High-speed digital signal processing systems
  • Network infrastructure equipment requiring low latency
  • Industrial control units operating in extreme temperatures
  • Embedded memory buffers for complex logic applications

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the extended industrial temperature rating of -40°C to +100°C against the official datasheet. Confirm the BGA-165 package dimensions match your PCB footprint requirements. Ensure the 2.5V/3.3V dual-voltage capability aligns with your system's core supply specifications before finalizing procurement.

Memory IC Selection Notes

Select this component when a high-density 144 Mbit SRAM with 250 MHz synchronous performance is required. It is suitable for designs needing both pipeline and flow-through operational modes. Consider the BGA-165 form factor for compact layouts. Verify that the 490 mA peak current draw fits within your power budget constraints.

Memory IC Part Context

This part belongs to the GS81282Z18GD series of NoBL™ and ZBT™ SRAMs. These devices are designed for high-performance embedded memory applications. The series offers various speed grades and organizations, providing scalability for different bandwidth requirements while maintaining compatibility with standard interfaces.

Memory IC Replacement Considerations

Check for other speed grades within the GS81282Z18GD family, such as the -200I variant, if lower power consumption is prioritized over the 250 MHz maximum frequency. Ensure any substitute maintains the same BGA-165 package and 8M x 18 bit organization.

GS81282Z18GD-250IGS81282Z18GD-250I
$170.46
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