Memory IC GS81282Z36GD-200IV product image

GS81282Z36GD-200IV

$170.46
  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:ad45dffb3a11 Category: Brand:

  
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GS81282Z36GD-200IV is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 144MBIT PAR 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS81282Z36GD-200IV

  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, ZBT
  • Memory Size:144Mbit
  • Memory Organization:4M x 36
  • Memory Interface:Parallel
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 2V, 2.3V ~ 2.7V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS81282Z36GD-200IV

GS81282Z36GD-200IV

Memory IC Overview

The GS81282Z36GD-200IV is a 144 Mbit Synchronous NBT SRAM manufactured by GSI Technology. It features a memory organization of 4 M x 36 and supports a maximum clock frequency of 200 MHz with an access time of 6.5 ns. The device operates within a supply voltage range of 2.3 V to 3.6 V, with maximum supply currents of 350 mA and 420 mA. It utilizes a parallel interface and is housed in a 165-pin BGA package suitable for surface mount technology. The component supports industrial temperature ranges from -40°C to +100°C.

Memory IC Feature Summary

  • Supports both Pipeline and Flow Through operational modes for flexible data handling
  • Features ZQ mode pin for user-selectable high or low output drive strength
  • Includes LBO pin configuration for Linear or Interleave Burst mode operation
  • Integrates IEEE 1149.1 JTAG-compatible Boundary Scan for testing

Memory IC Applications

  • High-speed data buffering in telecommunications equipment
  • Cache memory implementation in network processing systems
  • Data storage in industrial control applications requiring wide data buses
  • Embedded systems utilizing synchronous burst access patterns

Memory IC Procurement Notes

Verify the specific suffix IV against official GSI Technology documentation to confirm the exact voltage and temperature grade specifications. Ensure compatibility with the target system's power supply rails and thermal management requirements. Confirm that the 165-pin BGA footprint matches the design layout. Check for RoHS compliance status as indicated in the manufacturer's current datasheet before finalizing procurement.

Memory IC Selection Notes

Select this component when a wide 36-bit data bus and synchronous operation at 200 MHz are required. The choice between Pipeline and Flow Through modes should align with the system's latency and throughput needs. Consider the 165-pin BGA package constraints for PCB routing density. Verify that the operating temperature range meets the environmental conditions of the intended deployment scenario.

Memory IC Part Context

This part belongs to the GS81282Z36GD series of Synchronous NBT SRAMs. It shares architectural similarities with other devices in the family, such as the GS81282Z36GD-200I, but differs in specific electrical characteristics and packaging options. The series is designed for high-performance applications requiring fast random access and configurable burst modes.

Memory IC Replacement Considerations

The GS81282Z36GD-200I is a related variant within the same product family. Verify pinout compatibility and electrical parameter alignment before substitution. Ensure that any replacement part meets the specific voltage and temperature requirements of the original design.

GS81282Z36GD-200IVGS81282Z36GD-200IV
$170.46
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