Memory IC GS81282Z36GD-250I product image

GS81282Z36GD-250I

$170.46
  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:13ee28802953 Category: Brand:

  
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GS81282Z36GD-250I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 144MBIT PAR 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS81282Z36GD-250I

  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, ZBT
  • Memory Size:144Mbit
  • Memory Organization:4M x 36
  • Memory Interface:Parallel
  • Clock Frequency:250 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.3V ~ 2.7V, 3V ~ 3.6V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS81282Z36GD-250I

GS81282Z36GD-250I

Memory IC Overview

The GS81282Z36GD-250I is a 144 Mbit NBT SRAM manufactured by GSI Technology. It features a 4M x 36 organization with a parallel interface and SDR storage type. The device supports a maximum clock frequency of 250 MHz and achieves an access time of 5.5 ns. Operating voltage ranges from 2.3 V to 3.6 V, with maximum supply currents of 375 mA and 490 mA. It is housed in a BGA-165 package for SMD/SMT mounting and operates within a temperature range of -40°C to +100°C.

Memory IC Feature Summary

  • Supports both NBT Pipeline and Flow Through architectures for flexible data handling.

Memory IC Applications

  • High-speed data buffering in telecommunications systems
  • Cache memory implementation in network processing equipment
  • Data storage in industrial control applications requiring wide temperature operation

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the extended industrial temperature range of -40°C to +100°C against the official datasheet. Confirm the BGA-165 package dimensions match the target PCB footprint. Ensure power supply specifications align with the 2.3V to 3.6V operating window and current requirements of 375 mA or 490 mA as documented.

Memory IC Selection Notes

Select this component when a 144 Mbit capacity with a 36-bit word width is required. The 250 MHz speed and 5.5 ns access time suit high-performance synchronous designs. The industrial temperature rating makes it suitable for harsh environments compared to commercial variants. Verify compatibility with the parallel interface protocol defined in the technical documentation.

Memory IC Part Context

This part belongs to the GS81282Z36GD series of NBT SRAMs. It shares architectural similarities with other members like the GS81282Z36GB-250I but differs in package type (BGA-165 versus BGA-119) and thermal performance. The series utilizes GSI's proprietary NBT technology for high-density memory solutions.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material.

GS81282Z36GD-250IGS81282Z36GD-250I
$170.46
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