Memory IC GS81302D38AGD-633I product image

GS81302D38AGD-633I

$277.94
  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:fef878133dc4 Category: Brand:

  
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GS81302D38AGD-633I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 144MBIT PAR 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS81302D38AGD-633I

  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous, QDR II+
  • Memory Size:144Mbit
  • Memory Organization:4M x 36
  • Memory Interface:Parallel
  • Clock Frequency:633 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (13x15)
  • Access Time:-

Memory IC datasheet and documents for GS81302D38AGD-633I

GS81302D38AGD-633I

Memory IC Overview

The GS81302D38AGD-633I is a 144 Mbit Quad Data Rate (QDR) static random-access memory component manufactured by GSI Technology. It features a 4 M x 36 organization and supports a maximum clock frequency of 633 MHz via a parallel interface. The device operates within a supply voltage range of 1.7 V to 1.9 V, with a maximum power current of 1.24 A. Designed for surface-mount installation, it utilizes a BGA-165 package. The component belongs to the SigmaQuad-II+ series and is rated for an industrial operating temperature range from -40°C to +100°C.

Memory IC Feature Summary

  • Supports four beats of data transfer per clock cycle utilizing QDR technology
  • Industrial temperature rating extending operation up to +100°C
  • High-speed parallel interface architecture

Memory IC Applications

  • Network infrastructure equipment
  • Telecommunications systems
  • Data routing applications

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the extended industrial temperature range (-40°C to +100°C) compared to commercial variants. Confirm the 'GD' designation aligns with the required BGA-165 package and lead finish specifications. Ensure the 633 MHz speed grade matches system timing requirements. Cross-reference the manufacturer part number with official GSI Technology documentation to validate availability and revision status before procurement.

Memory IC Selection Notes

Select this component when high-bandwidth parallel memory is required for networking or telecom applications. The 4 M x 36 organization suits wide-data-path architectures. The industrial temperature range is critical for harsh environments. Compare against other GS81302 variants based on speed grade and temperature rating to ensure compatibility with existing board designs and thermal constraints.

Memory IC Part Context

This part belongs to the GS81302D38AGD family of SigmaQuad-II+ SRAMs. It shares the 144 Mbit capacity and 4 M x 36 organization with other members like the GS81302D38AGD-633. The primary differentiator is the '-I' suffix indicating industrial temperature capability and the '-633' indicating the 633 MHz speed bin. It represents a high-performance solution within GSI's QDR portfolio.

Memory IC Replacement Considerations

Direct substitutes include other GS81302D38AGD variants with matching pinouts and electrical characteristics. Verify that any replacement maintains the 633 MHz speed grade and industrial temperature range if those are strict requirements. Check for minor revisions in the datasheet that might affect timing parameters.

GS81302D38AGD-633IGS81302D38AGD-633I
$277.94
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