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GS81302DT37GE-450I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 144MBIT PAR 165FPBGA. Review the specifications below when checking this part for your BOM.
The GS81302DT37GE-450I is a 144 Mbit Static Random Access Memory (SRAM) manufactured by GSI Technology. It features a memory organization of 4 M x 36 bits and operates with a maximum clock frequency of 450 MHz, corresponding to an access time of 450 ps. The device utilizes a parallel interface and is powered by a voltage range between 1.7 V and 1.9 V, with a maximum power current of 1.2 A. It is housed in a BGA-165 package suitable for surface mount installation and supports industrial operating temperatures from -40°C to +85°C.
Verify the specific suffix 'I' confirms the industrial temperature rating (-40°C to +85°C) against the manufacturer's official datasheet. Confirm the BGA-165 package dimensions and pinout compatibility with the target PCB design. Ensure the 1.7V to 1.9V power supply requirements are strictly met to prevent operational instability or damage to the component.
Select this component when a 144 Mbit capacity with a 36-bit word width is required for parallel processing applications. The 450 MHz speed makes it suitable for high-throughput data paths. Consider the BGA-165 footprint for space-constrained designs. Verify that the system power delivery can support the peak current draw specified in the electrical characteristics table.
This part belongs to the SigmaDDR-II+ family of SRAMs from GSI Technology. These devices are engineered for high-density memory solutions in demanding electronic environments. The GS81302 series specifically targets applications needing robust data storage with fast read/write cycles, distinguishing itself through its wide operating temperature range and standardized parallel interface.
Cross-reference with other GS81302 variants such as GS81302D37AGD-450I for potential functional substitutes. Verify that any alternative maintains the same 4M x 36 organization and BGA-165 package to ensure mechanical and electrical compatibility without redesigning the host circuit board.
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