Memory IC GS81302DT38AGD-633I product image

GS81302DT38AGD-633I

$277.94
  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:db8d52a47151 Category: Brand:

  
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GS81302DT38AGD-633I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 144MBIT PAR 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS81302DT38AGD-633I

  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous, QDR II+
  • Memory Size:144Mbit
  • Memory Organization:4M x 36
  • Memory Interface:Parallel
  • Clock Frequency:633 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (13x15)
  • Access Time:-

Memory IC datasheet and documents for GS81302DT38AGD-633I

GS81302DT38AGD-633I

Memory IC Overview

The GS81302DT38AGD-633I is a 144 Mbit Quad Data Rate (QDR) II+ static random-access memory manufactured by GSI Technology. It features an organization of 4 Megawords by 36 bits and supports a maximum clock frequency of 633 MHz. The device operates within a supply voltage range of 1.7 V to 1.9 V, with a maximum power consumption current of 1.15 A. It utilizes a parallel interface and is housed in a 165-ball BGA package suitable for surface mount technology. The component is rated for an industrial operating temperature range from -40°C to +100°C.

Memory IC Feature Summary

  • Supports four data beats per clock cycle via QDR II+ architecture
  • Provides high-speed parallel data transfer capabilities
  • Operates within standard low-voltage power specifications

Memory IC Applications

  • High-performance networking equipment
  • Telecommunications infrastructure systems
  • Industrial control applications requiring wide temperature tolerance

Memory IC Procurement Notes

Verify the specific suffix codes against official datasheets to confirm temperature grade and package variations. Ensure compatibility with system voltage requirements ranging from 1.7 V to 1.9 V. Confirm lead times and availability directly with authorized distributors as stock levels fluctuate. Validate that the 165-ball BGA footprint matches the target PCB design constraints.

Memory IC Selection Notes

Select this component when high bandwidth and deterministic latency are required for 36-bit data paths. Compare against other SigmaQuad-II+ variants based on specific clock speed needs and organizational width. Consider the industrial temperature rating for harsh environments. Evaluate power consumption limits against available thermal management solutions for the 1.15 A maximum current draw.

Memory IC Part Context

This part belongs to the GSI Technology SigmaQuad-II+ family of synchronous SRAMs. These devices are designed to maximize bus utilization by transferring multiple data words per clock cycle. The series offers various density and speed options, positioning these components as solutions for demanding data-intensive applications where traditional SRAM bandwidth limitations would be restrictive.

Memory IC Replacement Considerations

Check for other GS81302 variants with different clock speeds or organizations. Verify pin-to-pin compatibility with existing designs before substitution.

GS81302DT38AGD-633IGS81302DT38AGD-633I
$277.94
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